0000000000011130
AUTHOR
Michael Waldow
Recess photomask contact lithography and the fabrication of coupled silicon photonic and plasmonic waveguide switches
Display Omitted A lithography technique capable of printing submicron-sized features inside deep cavities is presented.A so-called recess photomask adapted to the wafer's topography is employed.Based on a standard mask aligner, Recess Photomask Contact Lithography has moderate cost.Its efficiency for a photonic/plasmonic switch application was demonstrated experimentally.The technique is extensible to any design and to wafers with multiple level recesses. A novel lithographic method is presented, based on the use of a mask aligner in the contact mode with a modified photomask, the so-called recess photomask; its goal is the printing of submicron-sized patterns into deep cavities of a chip, …
Dielectric-loaded plasmonic waveguide components: Going practical
Surface plasmon propagating modes supported by metal/dielectric interfaces in various configurations can be used for radiation guiding similarly to conventional dielectric waveguides. Plasmonic waveguides offer two attractive features: subdiffraction mode confinement and the presence of conducting elements at the mode-field maximum. The first feature can be exploited to realize ultrahigh density of nanophotonics components, whereas the second feature enables the development of dynamic components controlling the plasmon propagation with ultralow signals, minimizing heat dissipation in switching elements. While the first feature is yet to be brought close to the domain of practical applicatio…
Low energy routing platforms for optical interconnects using active plasmonics integrated with Silicon Photonics
Power consumption and bandwidth of electronics appear as the main set of technology barriers in next-generation Data Center and High-Performance Computing (HPC) environments. The limited capacity and pitch lane of electrically wired interconnects require the development of new disruptive technologies to cope with the massive amount of data moving across all hierarchical communication levels, namely rack-to-rack, backplane, chip-to-chip and even on-chip interconnections. Plasmonics comes indeed as a disruptive technology that enables seamless interoperability between light beams and electronic control signals through the underlying metallic layer, providing thereby an inherent energy-efficie…