Direct Writing on Copper Ion Doped Silica Films by Electrogeneration of Metallic Microstructures

International audience; A facile and rapid localized electrochemical reduction of colloid copper particles is proposed using the scanning electrochemical,microscope (SECM), technique. In this purpose, thin films of composite silica :glass containing copper salts were prepared by the sol-gel method via the dip coating technique. Acid-catalyzed tetraethylorthosilane (TEOS) solutions charged with copper nitrate were used as precursors. This one-pot experiment can be performed in mild conditions. The localized generation of copper metallic nanostructures on silica film has been performed by electroreduction of methyl viologen on an ultramicroelectrode (UME). The UME generates reducing species, …