0000000000640011

AUTHOR

Ahmed Kandory

Direct Writing on Copper Ion Doped Silica Films by Electrogeneration of Metallic Microstructures

International audience; A facile and rapid localized electrochemical reduction of colloid copper particles is proposed using the scanning electrochemical,microscope (SECM), technique. In this purpose, thin films of composite silica :glass containing copper salts were prepared by the sol-gel method via the dip coating technique. Acid-catalyzed tetraethylorthosilane (TEOS) solutions charged with copper nitrate were used as precursors. This one-pot experiment can be performed in mild conditions. The localized generation of copper metallic nanostructures on silica film has been performed by electroreduction of methyl viologen on an ultramicroelectrode (UME). The UME generates reducing species, …

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Electrochemical deposition of a luminescent alkoxysilyl-based fluorenone film exhibiting halide sensitivity

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Electrogeneration of Diiodoaurate in Dimethylsulfoxide on Gold Substrate and Localized Patterning

International audience; A localized etching of gold surface by scanning electrochemical microscope technique is presented where a dimethylsulfoxide-based electrolyte charged with iodine is used. The electrogenerated triiodide ion at the platinum ultramicroelectrode tip (feedback mode) acts as an oxidant for gold surface. The effects of electrode diameter and the bias time have been investigated. The approach curve method was used to hold the electrode tip close to the gold surface. A scanning electron microscope is used to observe the etched gold surfaces where disk-shaped dots are generated. The diameter of these holes depends directly on the Pt electrode diameter and the bias time.

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