0000000000976079

AUTHOR

Gilabert David

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Impact of Gamma Radiation on Dynamic R

2019

GaN high-electron-mobility transistors (HEMTs) are promising next-generation devices in the power electronics field which can coexist with silicon semiconductors, mainly in some radiation-intensive environments, such as power space converters, where high frequencies and voltages are also needed. Its wide band gap (WBG), large breakdown electric field, and thermal stability improve actual silicon performances. However, at the moment, GaN HEMT technology suffers from some reliability issues, one of the more relevant of which is the dynamic on-state resistance (RON_dyn) regarding power switching converter applications. In this study, we focused on the drain-to-source on-resistance (RDSON) char…

total ionizing dose (TID)high-electron-mobility transistor (HEMT)assurance testingradiation effectsgallium nitride (GaN)radiation hardnessArticleMaterials (Basel, Switzerland)
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