6533b7d2fe1ef96bd125ddf8
RESEARCH PRODUCT
Study of interface formation during diffusion bonding : compact heat exchangers application
Nicolas Bouquetsubject
FranchissementAustenitic stainless steel 316L[CHIM.OTHE] Chemical Sciences/OtherHot Isostatic PressingCroissance de grains[ CHIM.OTHE ] Chemical Sciences/OtherCompression Isostatique à ChaudPropriétés mécaniquesMechanical properties[CHIM.OTHE]Chemical Sciences/OtherAcier austénitique 316LGrain growthdescription
Compact diffusion bonded heat exchangers are an attractive option in many fields (nuclear, (petro-)chemistry, solar…) due to their performance. This type of concept is especially intended for manufacturing the energy conversion system of the ASTRID reactor. During diffusion bonding by HIP, the problem is twofold: the channel deformation and microstructure evolution must be controlled, while at the same time, highly resistant interfaces are desired. This thesis is focused on the understanding and the control of the bonded components microstructure prepared by HIP in order to define « process » criteria to achieve welds in agreement with specifications of components containing fluidic channels: interfaces unaffected by the process and small grain size. After a detailed characterization of their surface and microstructural evolution during heating, the behavior of AISI 316L austenitic steel sheets has been examined in a parametric study by varying the parameters related to process (diffusion bonding temperature and pressure) and welding material (thickness, surface finish…). The results show that the interface formation is driven by conventional grain growth mechanisms with an interfacial pining more or less marked depending on surface characteristics. The mechanical properties of assemblies have been tested to determine the influence of defects. Though pores are the most critical default, the influence of other heterogeneities has also been highlighted. The different steps of bond formation have been identified by performing interrupted diffusion bonding test. The interest of modeling approach by Level-Set method to simulate microstructure evolution has been finally discussed.
year | journal | country | edition | language |
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2014-11-07 |