6533b854fe1ef96bd12af358
RESEARCH PRODUCT
Crack growth analysis at adhesive–adherent interface in bonded joints under mixed mode I/II
L. MistrettaAntonino CirelloGiuseppe Vincenzo MarannanoSalvatore Pastasubject
Strain energy release rateMaterials sciencebusiness.industryMechanical EngineeringDelaminationCrack tip opening displacementFracture mechanicsStructural engineeringParis' lawCrack growth resistance curveCrack closureMechanics of Materialsmental disordersGeneral Materials ScienceAdhesiveComposite materialbusinessdescription
The propagation of an interface crack subjected to mixed mode I/II was investigated for two 2024-T351 aluminum thin layers joined by means of DP760 epoxy adhesive produced by 3M©. On the basis of beam theory, an analytical expression for computing the energy release rate is presented for the mixed-mode end loaded split (MMELS) test. The analytical strain energy release rate was compared by finite element (FE) analysis using the virtual crack closure technique (VCCT). Several fatigue crack growth tests were carried out in a plane bending machine to compare the experimental energy release rates to those of the analytical and FE solutions. Experimental results showed the relationship between the delamination modality and initial crack length rather than the applied load. The crack growth behavior showed stable crack growth followed by rapid propagation at the interface with the adhesive layer.
| year | journal | country | edition | language |
|---|---|---|---|---|
| 2008-12-01 |