6533b855fe1ef96bd12b069a
RESEARCH PRODUCT
Intrinsic defect formation in amorphousSiO2by electronic excitation: Bond dissociation versus Frenkel mechanisms
Koichi KajiharaKoichi KajiharaLinards SkujaLinards SkujaHideo HosonoMasahiro Hiranosubject
Materials scienceSiliconDangling bondchemistry.chemical_elementCondensed Matter PhysicsDissociation (chemistry)Electronic Optical and Magnetic MaterialsAmorphous solidCrystallographychemistryKröger–Vink notationFrenkel defectAtomic physicsExcitationdescription
Two competing mechanisms of intrinsic defect formation in amorphous ${\text{SiO}}_{2}$ $(a{\text{-SiO}}_{2})$, i.e., the vacancy-interstitial (Frenkel) mechanism and Si-O bond dissociation to form silicon and oxygen dangling bonds, were compared under $\ensuremath{\gamma}$-ray electronic excitation. The Frenkel mechanism was found to be dominant. The concentrations of both kinds of defects strongly correlate with the degree of the structural disorder of $a{\text{-SiO}}_{2}$, providing experimental evidence that both types of intrinsic defect pairs are formed mainly from the strained Si-O-Si bonds. The bond dissociation mechanism is more susceptible to the structural disorder than the vacancy-interstitial mechanism.
year | journal | country | edition | language |
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2008-09-16 | Physical Review B |