6533b86ffe1ef96bd12ce831
RESEARCH PRODUCT
Superconducting tunnel junction fabrication on three-dimensional topography via direct laser writing
Samuli HeiskanenIlari Maasiltasubject
FabricationMaterials sciencePhysics and Astronomy (miscellaneous)FOS: Physical sciences02 engineering and technologyengineering.material01 natural scienceslaw.inventionSuperconductivity (cond-mat.supr-con)Coatinglaw0103 physical sciencesMesoscale and Nanoscale Physics (cond-mat.mes-hall)Quantum information scienceLithography010302 applied physicsSuperconductivityCondensed Matter - Mesoscale and Nanoscale Physicsbusiness.industryCondensed Matter - Superconductivity021001 nanoscience & nanotechnologyLaserResistengineeringOptoelectronicsSuperconducting tunnel junction0210 nano-technologybusinessdescription
Superconducting junctions are widely used in multitude of applications ranging from quantum information science and sensing to solid-state cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing (DLW) two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal-insulator-superconductor (NIS) tunnel junctions can be fabricated on top of a 20 $\mu$m tall three-dimensional topography. Combined with more advanced resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.
| year | journal | country | edition | language |
|---|---|---|---|---|
| 2020-12-07 |