Search results for "Chip"
showing 10 items of 386 documents
0.48Tb/s (12x40Gb/s) WDM transmission and high-quality thermo-optic switching in dielectric loaded plasmonics
2012
We demonstrate Wavelength Division Multiplexed (WDM)-enabled transmission of 480Gb/s aggregate data traffic (12x40Gb/s) as well as high-quality 1x2 thermo-optic tuning in Dielectric-Loaded Surface Plasmon Polariton Waveguides (DLSPPWs). The WDM transmission characteristics have been verified through BER measurements by exploiting the heterointegration of a 60 mu m-long straight DLSPPW on a Silicon-on-Insulator waveguide platform, showing error-free performance for six out of the twelve channels. High-quality thermo-optic tuning has been achieved by utilizing Cycloaliphatic-Acrylate-Polymer as an efficient thermo-optic polymer loading employed in a dual-resonator DLSPPW switching structure, …
Ultrahigh-Q Tunable Whispering-Gallery-Mode Microresonator
2009
Typical microresonators exhibit a large frequency spacing between resonances and a limited tunability. This impedes their use in a large class of applications which require a resonance of the microcavity to coincide with a predetermined frequency. Here, we experimentally overcome this limitation with highly prolate-shaped whispering-gallery-mode "bottle microresonators" fabricated from standard optical glass fibers. Our resonators combine an ultra-high quality factor of 360 million, a small mode volume, and near lossless fibre coupling, characteristic of whispering-gallery-mode resonators, with a simple and customizable mode structure enabling full tunability.
CMOS Photodiode Design for Gamma Camera Application
2008
We designed new photodiodes sensors including current mirror amplifiers. These photodiodes have been fabricated using a CMOS 0.6 micrometers process from Austria Micro System (AMS). The photodiode areas are respectively 1 mm × 1 mm and 0.4 mm × 0.4 mm with fill factor 98% and total chip area is 2 square millimetres. The sensor pixels show a logarithmic response in illumination and are capable of detecting very low blue light (less than 0.5 lux) . These results allow to use our sensor in new gamma camera solid-state concept.
Development of a three-dimensional cell culture system based on microfluidics for nuclear magnetic resonance and optical monitoring
2014
A new microfluidic cell culture device compatible with real-time nuclear magnetic resonance (NMR) is presented here. The intended application is the long-term monitoring of 3D cell cultures by several techniques. The system has been designed to fit inside commercially available NMR equipment to obtain maximum readout resolution when working with small samples. Moreover, the microfluidic device integrates a fibre-optic-based sensor to monitor parameters such as oxygen, pH, or temperature during NMR monitoring, and it also allows the use of optical microscopy techniques such as confocal fluorescence microscopy. This manuscript reports the initial trials culturing neurospheres inside the micro…
An experimental analysis of thick-film solid-state reference electrodes
2012
Thick-Film planar solid-state Silver/Silver Chloride (Ag/AgCl) reference electrodes were developed and tested for ion susceptibility and long term drift in approximately 0.04 M potassium chloride (KCl) solution. Various types of electrodes were tested exhibiting stabilities down to 2 millivolts per decade change of chloride concentration. It is demonstrated that Thick-Film reference electrodes are suitable for use in underground soil measurements due to their ruggedness and robustness.
10 Gb/s transmission and thermo-optic resonance tuning in silicon-plasmonic waveguide platform
2011
The first system-level experimental results of hybrid Si-DLSPP structures incorporated into a SOI chip are reported. We demonstrate over 7nm thermo-optical tuning of a Si-Plasmonic racetrack-resonator and verify error-free 10Gb/s transmission through 60um Si-Plasmonic waveguide.
Biochips for cell biology by combined dip-pen nanolithography and DNA-directed protein immobilization.
2013
A general methodology for patterning of multiple protein ligands with lateral dimensions below those of single cells is described. It employs dip pen nanolithography (DPN) patterning of DNA oligonucleotides which are then used as capture strands for DNA-directed immobilization (DDI) of oligonucleotide-tagged proteins. This study reports the development and optimization of PEG-based liquid ink, used as carrier for the immobilization of alkylamino-labeled DNA oligomers on chemically activated glass surfaces. The resulting DNA arrays have typical spot sizes of 4-5 μm with a pitch of 12 μm micrometer. It is demonstrated that the arrays can be further functionalized with covalent DNA-streptavidi…
Chip-to-chip plasmonic interconnects and the activities of EU project NAVOLCHI
2012
In this paper, the chip-to-chip interconnection architecture adopted by the EU-project NAVOLCHI are discussed. The plasmonic physical layer consisting of a plasmonic nanoscale laser, a modulator, an amplifier and a detector is introduced. Current statuses of the plasmonic devices are reviewed.
Composite layer-based analytical models for tool–chip interface temperatures in machining medium carbon steels with multi-layer coated cutting tools
2006
Abstract This investigation is devoted to the thermal problems in dry orthogonal turning of a C45 medium carbon steel with natural contact tools treated with multi-layer coatings with an intermediate Al 2 O 3 layer. New hybrid analytical models for estimating heat partition to the chip and the tool–chip interface temperatures were proposed. Furthermore, the physics-based modelling concept, which applies composite layer approach was developed to estimate the average and maximum steady-state tool–chip interface temperatures in orthogonal turning. The model predictions were compared to appropriate experimental process data using natural tool-work thermocouples and other simulated and measured …
Orthogonal and Oblique Cutting Mechanics
2008
This chapter provides the engineering knowledge and modelling techniques applied in description of the material behaviour in the cutting zone resulting in chip formation and its separation from the bulk material. Geometrical and kinematical characteristics of orthogonal and oblique cutting models are classified and specified. Forces acting on the cutting tools and their measurement methods for several machining operations, such as turning, milling, drilling, boring and grooving, are presented. Moreover, forces acting in the cutting zone and their resolution on the shear plane and the rake and flank faces, along with stress distributions, are presented. The chapter highlights how components …