Electrochemistry nanometric patterning of MOF particles: Anisotropic metal electrodeposition in Cu/MOF

Abstract Electrodeposition of copper from Cu/MOF immersed into acetate buffer produces a quasi-periodic series of 10–20 nm sized laminae sandwiched within the pristine MOF lattice as monitored by voltammetry of microparticles/atomic force microscopy. This anisotropic patterning can be qualitatively described in terms of a highly orientation-dependent diffusion of electrons and charge-balancing electrolyte counterions in the MOF network.