6533b81ffe1ef96bd1277b14
RESEARCH PRODUCT
Electrochemistry nanometric patterning of MOF particles: Anisotropic metal electrodeposition in Cu/MOF
Antonio DoménechHermenegildo Garcı´aMarı´a Teresa Doménech-carbóFrancesc Llabrés-i-xamenasubject
ChemistryInorganic chemistrychemistry.chemical_elementElectrolyteBuffer solutionElectrochemistryCopperlcsh:Chemistrychemistry.chemical_compoundlcsh:Industrial electrochemistrylcsh:QD1-999Transition metalTransmission electron microscopyElectrochemistryMetal-organic frameworkVoltammetrylcsh:TP250-261description
Abstract Electrodeposition of copper from Cu/MOF immersed into acetate buffer produces a quasi-periodic series of 10–20 nm sized laminae sandwiched within the pristine MOF lattice as monitored by voltammetry of microparticles/atomic force microscopy. This anisotropic patterning can be qualitatively described in terms of a highly orientation-dependent diffusion of electrons and charge-balancing electrolyte counterions in the MOF network.
| year | journal | country | edition | language |
|---|---|---|---|---|
| 2006-12-01 | Electrochemistry Communications |