0000000000465975
AUTHOR
Maxime Jacquot
Single-shot ultrafast laser processing of high-aspect-ratio nanochannels using elliptical Bessel beams
Ultrafast lasers have revolutionized material processing, opening a wealth of new applications in many areas of science. A recent technology that allows the cleaving of transparent materials via non-ablative processes is based on focusing and translating a high-intensity laser beam within a material to induce a well-defined internal stress plane. This then enables material separation without debris generation. Here, we use a non-diffracting beam engineered to have a transverse elliptical spatial profile to generate high aspect ratio elliptical channels in glass of dimension 350 nm x 710 nm, and subsequent cleaved surface uniformity at the sub-micron level.
Deviation from threshold model in ultrafast laser ablation of graphene at sub-micron scale
International audience; We investigate a method to measure ultrafast laser ablation threshold with respect to spot size. We use structured complex beams to generate a pattern of craters in CVD graphene with a single laser pulse. A direct comparison between beam profile and SEM characterization allows us to determine the dependence of ablation probability on spot-size, for crater diameters ranging between 700 nm and 2.5 μm. We report a drastic decrease of ablation probability when the crater diameter is below 1 μm which we interpret in terms of free-carrier diffusion.