0000000000594256

AUTHOR

O. Sychev

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Ab initio modeling of copper adhesion on regular BaTiO3(001) surfaces

2005

Ab initio calculations have been performed for copper adsorption on a regular, defect-free TiO"2- and BaO-terminated (001) surfaces of a cubic BaTiO"3, using a posteriori HF-CC method as implemented into the CRYSTAL-03 computer code. To clarify the nature of the interfacial bonding, we use slab models of the Cu/BaTiO"3(001) interfaces with different one-side substrate coverages, varied from 1/8 monolayer (ML) up to 1/2 ML, over both TiO"2- and BaO-terminated surfaces. TiO"2 termination has been found to be energetically more favorable for the adsorption of copper atoms. In agreement with previous experimental and theoretical data, our calculations indicate essential contribution of atomic p…

ChemistryBinding energyAb initiochemistry.chemical_elementSubstrate (electronics)Electronic structureCondensed Matter PhysicsCopperAtomic and Molecular Physics and OpticsSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialsAdsorptionAb initio quantum chemistry methodsChemical physicsMonolayerElectrical and Electronic EngineeringAtomic physicsMicroelectronic Engineering
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