6533b7dbfe1ef96bd1270202

RESEARCH PRODUCT

Task scheduling control of BGA solder joint process in flexible manufacturing system

Filippo D'ippolitoFrancesco AlongeV. AielloP.m. Raimondi

subject

EngineeringSupervisorbusiness.industryReworkFlexible manufacturing systemMechanical engineeringBall Grid Arrays (BGA)GridControl parameterOpen loop control algorithmsPrinted circuit boardSettore ING-INF/04 - AutomaticaEmbedded systemBall grid arrayvisual_artSolderingElectronic componentvisual_art.visual_art_mediumbusiness

description

This paper describes an open loop control method of the solder joint process in a rework station for faulty printed circuit board (PCBs) containing electronic components in packages ball grid arrays (BGAs). In particular, a mathematical model describing the solder joint process is, first of all, obtained. Then, the desired thermal profile of the junctions BGA-PCB is determined according to the physical constraints of the rework station framework. The control parameters corresponding to the above desired thermal profile are identified using the above mathematical model. Finally, the open loop control algorithm is implemented on the supervisor interface of the rework station in order to carried out experimental validation of the proposed method

yearjournalcountryeditionlanguage
2006-04-07
10.1109/etfa.2005.1612677http://hdl.handle.net/10447/27942