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RESEARCH PRODUCT
Thermal Characterization of the Chip-Tool Interface When Using Coated Turning Inserts
Piotr NiesłonyW. Grzesiksubject
Materials scienceCarbon steelStrategy and ManagementMetallurgychemistry.chemical_elementSubstrate (electronics)Management Science and Operations Researchengineering.materialIndustrial and Manufacturing EngineeringCoatingchemistryHeat fluxThermocoupleengineeringAustenitic stainless steelTinIntensity (heat transfer)description
Abstract This paper reports some results of extensive experimental investigations of the thermal interactions between the coating/substrate and the moving surface of the chip. Semi-orthogonal cutting when bar turning a medium carbon steel and an austenitic stainless steel was carried out. Both flat-faced and grooved inserts coated with TiC, TiC/TiN, and TiC/Al 2 O 3 /TiN were tested. A standard K-type thermocouple embedded in the workpiece was used to convert measured efm's to the interfacial temperatures. In addition, the chiprake contact length and the area of contact were determined by using computer processing of scanned contact images. The minimum steady-state temperature at the interface between the moving chip and the coating-substrate system was explained in terms of the heat flux intensity and the thermal properties of both components of a unique closed tribo-system.
| year | journal | country | edition | language |
|---|---|---|---|---|
| 2000-01-01 | Journal of Manufacturing Processes |