6533b857fe1ef96bd12b4331
RESEARCH PRODUCT
Analysis of EMI Shielding Effectiveness for plastic fiber composites in the 5G sub-6 GHz band
Adrian SuarezV. Ramirez-monsellC. Losada-fernandezA. AmaroPedro A. MartinezJose TorresB. Lopez-riusAntonio AlcarriaB. Galindo-galianaJorge Victoriasubject
VibrationFlexibility (engineering)Computer scienceEMIElectromagnetic shieldingElectromagnetic compatibilityElectronicsComposite materialElectromagnetic interferenceElectronic circuitdescription
The study and modeling of EMC are becoming more critical than ever due to the ubiquitous presence of electronic circuits in all aspects of our lives. Specifically, it is crucial to extend these studies to the new frequencies that, in a few years, will be a reality in modern telecommunications systems, such as 5G and its derived technologies. A specific critical field where the proper EMI shielding has been ensured to avoid EMC problems is the electric autonomous vehicles (EAVs). The huge number of electronics systems in new vehicles will dramatically extend the demands on the EMI shielding solutions used to attenuate the radiated emissions that could affect circuits in the vehicle. Metals or metal alloys are the most common EMI shielding materials since they demonstrate adequate shielding capacity against EMI. However, polymers have become up-and-coming materials for EMI shielding with the characteristics of lightweight, flexibility, cost-effective, easy processing, and resistance to corrosion. Consequently, it is necessary to develop EMI shielding materials based on polymers, plastic materials, and fiber composites that ensure compliance with the different standards that regulate 5G and the proper operation of possible systems susceptible to the intentional and unintended signals generated by this new technology. This contribution focuses on characterizing different composite structures' performance based on fibers combined with conductive materials in terms of shielding effectiveness, covering the 5G sub-6 GHz frequency range.
year | journal | country | edition | language |
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2021-07-26 | 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium |