6533b858fe1ef96bd12b6dff

RESEARCH PRODUCT

Residual strain and stress analysis by speckle interferometry combined with the drill of a groove

Manuel FrançoisAfaf MarasGuillaume MontayEmmanuelle RouhaudOlivier Sicot

subject

Materials sciencebusiness.industry[SPI] Engineering Sciences [physics]02 engineering and technology01 natural sciences010309 opticsStress (mechanics)[SPI]Engineering Sciences [physics]020210 optoelectronics & photonicsOpticsMachiningResidual stressElectronic speckle pattern interferometry0103 physical sciences0202 electrical engineering electronic engineering information engineeringStress relaxationUltrasonic sensorSpeckle imagingbusinessGroove (engineering)ComputingMilieux_MISCELLANEOUS

description

A new method for residual stresses determination combining Electronic Speckle Pattern Interferometry (ESPI) with the machining of a groove. The internal stress field is perturbed as the depth of the groove is increased incrementally [1]. The structure finds a new equilibrium state generating displacements which are measured using ESPI. This method was tested on an aluminium alloy plate treated locally by ultrasonic shot-peening. The investigation of the images obtained with the phase shifting technique and fringe patterns makes it possible to analyze, simultaneously, the stress profile along two directions: along the depth of the structure, and along the groove direction.

https://hal-utt.archives-ouvertes.fr/hal-02613862