6533b858fe1ef96bd12b6dff
RESEARCH PRODUCT
Residual strain and stress analysis by speckle interferometry combined with the drill of a groove
Manuel FrançoisAfaf MarasGuillaume MontayEmmanuelle RouhaudOlivier Sicotsubject
Materials sciencebusiness.industry[SPI] Engineering Sciences [physics]02 engineering and technology01 natural sciences010309 opticsStress (mechanics)[SPI]Engineering Sciences [physics]020210 optoelectronics & photonicsOpticsMachiningResidual stressElectronic speckle pattern interferometry0103 physical sciences0202 electrical engineering electronic engineering information engineeringStress relaxationUltrasonic sensorSpeckle imagingbusinessGroove (engineering)ComputingMilieux_MISCELLANEOUSdescription
A new method for residual stresses determination combining Electronic Speckle Pattern Interferometry (ESPI) with the machining of a groove. The internal stress field is perturbed as the depth of the groove is increased incrementally [1]. The structure finds a new equilibrium state generating displacements which are measured using ESPI. This method was tested on an aluminium alloy plate treated locally by ultrasonic shot-peening. The investigation of the images obtained with the phase shifting technique and fringe patterns makes it possible to analyze, simultaneously, the stress profile along two directions: along the depth of the structure, and along the groove direction.
year | journal | country | edition | language |
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2007-07-01 |