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RESEARCH PRODUCT

Large 256-Pixel X-ray Transition-Edge Sensor Arrays With Mo/TiW/Cu Trilayers

Ilari MaasiltaMika PrunnilaDavid GunnarssonM. R. J. PalosaariK. M. KinnunenLeif Grönberg

subject

X-ray spectroscopyMaterials scienceFabricationta213superconducting devicesta114business.industryta221Time constantcritical temperatureslarge format arraysCondensed Matter PhysicsElectronic Optical and Magnetic MaterialsCharacterization (materials science)transition-edge sensorsNanosensorX-ray spectroscopyOptoelectronicsWaferElectrical and Electronic EngineeringTransition edge sensorbusinessLayer (electronics)materials analysisnanosensors

description

We describe the fabrication and electrical characterization of 256-pixel X-ray transition-edge sensor (TES) arrays intended for materials analysis applications. The processing is done on 6-in wafers, providing capabilities on a commercial scale. TES films were novel proximity coupled Mo/TiW/Cu trilayers, where the thin TiW layer in between aims to improve the stability of the devices by preventing unwanted effects such as Mo/Cu interdiffusion. The absorber elements were electrodeposited gold of thickness 2 μm. The single-pixel design discussed here is the so-called Corbino geometry. Most design goals were successfully met, such as the critical temperature, thermal time constant, and transition steepness.

yearjournalcountryeditionlanguage
2015-06-01IEEE Transactions on Applied Superconductivity
10.1109/tasc.2014.2366641https://doi.org/10.1109/TASC.2014.2366641