Search results for "COPPER"
showing 10 items of 3029 documents
Polyphenoloxidase from Riesling and Dornfelder wine grapes (Vitis vinifera) is a tyrosinase.
2015
Abstract Polyphenoloxidases (PPO) of the type-3 copper protein family are considered to be catecholoxidases catalyzing the oxidation of o-diphenols to their corresponding quinones. PPO from Grenache grapes has recently been reported to display only diphenolase activity. In contrast, we have characterized PPOs from Dornfelder and Riesling grapes which display both monophenolase and diphenolase activity. Ultracentrifugation and size exclusion chromatography indicated that both PPOs occur as monomers with Mr of about 38 kDa. Non-reducing SDS–PAGE shows two bands of about 38 kDa exhibiting strong activity. Remarkably, three bands up to 60 kDa displayed only very weak PPO activity, supporting th…
DISORDERING MECHANISMS OF THE Cu(110) SURFACE
1994
We review recent theoretical work on the various disordering mechanisms of the Cu(110) surface. In these studies the properties of the surface, from the onset of enhanced anharmonicity in surface vibrations up to bulk melting point T M , have been studied using molecular dynamics and lattice-gas Monte Carlo methods with many-body interactions derived from the effective medium theory. Well after the onset of enhanced out-of-plane surface vibrations, clustering of surface defects is found to induce a roughening transition at T≈0.81T M , and surface premelting is found to occur at T≈0.97T M . These results suggest, that these transitions can both appear at Cu(110). The general picture of diso…
Impact of Superfinish Turning on Surface Integrity of Pure Copper
2011
Abstract The presented study deals with comprehension of relationships between machining cutting conditions and physical-chemical properties linked with surface integrity. A multi-physics model is presented to calculate residual stress, temperature and dislocation fields in the machined material. This model includes both thermal-mechanical, structural evolution and dynamic recristallisation approaches. The model was applied to pure copper after superfinish turning. Good agreement was found between numerical values and experimental ones. This paper also presents a work on the impact of mechanical and microstructural changes induced by machining on the electrochemical behaviour and corrosion …
Layer-by-layer identification of copper alteration products in metallic works of art using the voltammetry of microparticles.
2010
An in situ technique for layer-by-layer electrochemical analysis of solid surfaces using the voltammetry of microparticles is presented. The method is based on the determination of several shape-dependent parameters for voltammetric curves recorded at a graphite pencil working electrode in contact with the sample, all immersed into aqueous electrolytes. Repetitive square wave voltammetry and sequential application of constant potential reductive steps and voltammetric scans yield discernible responses for the corrosion products distributed in stratified layers on metal-based surfaces. This methodology is applied to identify alteration products of copper and copper alloys distributed in diff…
Direct Writing on Copper Ion Doped Silica Films by Electrogeneration of Metallic Microstructures
2017
International audience; A facile and rapid localized electrochemical reduction of colloid copper particles is proposed using the scanning electrochemical,microscope (SECM), technique. In this purpose, thin films of composite silica :glass containing copper salts were prepared by the sol-gel method via the dip coating technique. Acid-catalyzed tetraethylorthosilane (TEOS) solutions charged with copper nitrate were used as precursors. This one-pot experiment can be performed in mild conditions. The localized generation of copper metallic nanostructures on silica film has been performed by electroreduction of methyl viologen on an ultramicroelectrode (UME). The UME generates reducing species, …
Study of Copper Nitride Thin Film Structure
2016
Abstract X-ray diffraction and x-ray absorption spectroscopy at the Cu K-edge were used to study the atomic structure in copper nitride (Cu3N) thin films. Textured nanocrystalline films are obtained upon dc magnetron sputtering on substrates heated at about 190 °C, whereas amorphous films having strongly disordered structure already in the second coordination shell of copper are deposited in the absence of heating.
Water Influences on the Copper Active Site in Hemocyanin
2010
Active metal sites play a key role in the biochemistry of oxygen transport by hemocyanins. Observing the changes in the local electronic structure of the copper sites upon oxygenation is thus essen...
A physical-based constitutive model for surface integrity prediction in machining of OFHC copper
2017
International audience; Due to the rising interest in predicting machined surface integrity and sustainability, various models for metal cutting simulation have been developed. However, their accuracy depends deeply on the physical description of the machining process. This study aims to develop an orthogonal cutting model for surface integrity prediction, which includes a physical-based constitutive model of Oxygen Free High Conductivity (OFHC) copper. This constitutive model incorporates the effects of the state of stress and microstructure on the work material behavior, as well as a dislocation density-based model for surface integrity prediction. The coefficients of the constitutive mod…
Influence of cutting process mechanics on surface integrity and electrochemical behavior of OFHC copper
2014
The authors gratefully acknowledge the support received from IC ARTS and CEA Valduc; International audience; Superfinishing machining has a particular impact on cutting mechanics, surface integrity and local electrochemical behavior. In fact, material removal during this process induces geometrical, mechanical and micro-structural modifications in the machined surface and sub-surface. However, a conventional 3D cutting process is still complex to study in terms of analytical/numerical modeling and experimental process monitoring. So, researchers are wondering if a less intricate configuration such as orthogonal cutting would be able to provide information about surface integrity as close as…
Orthogonal cutting simulation of OFHC copper using a new constitutive model considering the state of stress and the microstructure effects
2016
International audience; This work aims to develop an orthogonal cutting model for surface integrity prediction, which incorporates a new constitutive model of Oxygen Free High Conductivity (OFHC) copper. It accounts for the effects of the state of stress on the flow stress evolution up to fracture. Moreover, since surface integrity parameters are sensitive to the microstructure of the work material, this constitutive model highlights also the recrystallization effects on the flow stress. Orthogonal cutting model is validated using experimental designed cutting tests. More accurate predictions were obtained using this new constitutive model comparing to the classical Johnson-Cook model.