Search results for "Electrical impedance"

Erratum: An Inverse Backscatter Problem for Electric Impedance Tomography

2011

We fix an incorrect statement from our paper [M. Hanke, N. Hyvonen, and S. Reusswig, SIAM J. Math. Anal., 41 (2009), pp. 1948–1966] claiming that two different perfectly conducting inclusions necessarily have different backscatter in impedance tomography. We also present a counterexample to show that this kind of nonuniqueness does indeed occur.

An integrated structural health monitoring system based on electromechanical impedance and guided ultrasonic waves

2015

We propose a structural health monitoring (SHM) paradigm based on the simultaneous use of ultrasounds and electromechanical impedance (EMI) to monitor waveguides. Methods based on the propagation of guided ultrasonic waves (GUWs) are increasingly used in all those SHM applications that benefit from built-in transduction, moderately large inspection ranges, and high sensitivity to small flaws. Meantime, impedance-based SHM promises to adequately assess locally the structural integrity of simple waveguides and complex structures such as bolted connections. As both methods utilize piezoelectric transducers bonded or embedded to the structure of interest, this paper describes a unified SHM para…

Impedance of space-charge-limited currents in organic light-emitting diodes with double injection and strong recombination

2006

The impedance model for a one-carrier space-charge-limited (SCL) current has been applied to explain some experimental features of double carrier organic light-emitting diodes. We report the analytical model of impedance of bipolar drift transport in SCL regime in the limit of infinite recombination. In this limit the ac impedance function is identical to that of a single carrier device, with a transit time modified by the sum of mobilities for electrons and holes, μn+μp. The static capacitance C(ω→0) is a factor of ¾ lower than the geometric capacitance, as observed for single carrier devices, but it is shifted to higher frequencies. It follows that impedance measurements in the dual-carri…

The reflection coefficient of a flared microstrip line radiating in an infinite parallel-plate waveguide

1993

In this article the reflection coefficient of a tapered microstrip line radiating in an infinite parallel-plate conducting waveguide is calculated. The reflection coefficient at the feed line is evaluated by using the aperture admittance of the horn and the scattering matrix of the continuous taper. The theoretical behavior of the aperture admittance is shown and the reflection coefficient of a microstrip horn radiating in the parallel-plate region of a bootlace lens is measured in order to verify the model. © 1993 John Wiley & sons, Inc.

A Package for the Analysis of Automated MV Distribution Networks

2005

A New Low Cost Coupling System for Power Line Communication on Medium Voltage Smart Grids

2018

This paper proposes and verifies the performance of an innovative and low cost coupling system for power line communication (PLC) on medium voltage (MV) smart grids. The coupling system makes use of the capacitive divider of the voltage detecting systems (VDSs) to inject and receive the PLC signal. VDS are usually already installed in the MV switchboards of the major electrical manufacturer all over the world according to IEC 61243-5. VDS are used to detect the presence of the mains voltage to guarantee personnel safety. An interface circuit has been developed to be connected between the PLC transceiver and the VDS socket. In this way, the PLC signal can be coupled to the MV network without…

A Method to Evaluate Voltages to Earth During an Earth Fault in an HV Network in a System of Interconnected Earth Electrodes of MV/LV Substations

2008

An easy and swift method to evaluate, in a system of interconnected earth electrodes, earth potentials on earthing systems of medium-voltage/low-voltage (MV/LV) substations, in an event of single-line-to-earth fault inside a high-voltage/medium- voltage (HV/MV) station, is presented. The advantage of the method is the simplicity of the mathematical model for solving complex systems of any size with a sufficient accuracy for practical purposes. This paper shows the results of simulations, performed on networks with different extensions and characteristics, organized in easy-to-read graphs and tables. A comparison of these results with the values obtained according to the procedure explained …

Design considerations for transformerless series resonant inverters for induction heating

2002

The aim of the paper is to present some preliminary ideas in order to overcome the output transformer in series resonant inverters for induction heating applications. By adding a third reactive element to the conventional two element resonant inverter, the output matching transformer can be eliminated, allowing accommodation of the resonant frequency and load with the only drawback being the need for an overdimensioning of the output capacitor bank, and benefiting from inherent short-circuit protection.

A PC-based low cost impedance and gain-phase analyzer

2008

Abstract In this paper, we present a practical and inexpensive impedance/gain-phase analyzer (IGPA), which is very useful in the design of electronic circuits. This instrument allows the Bode diagram of any network or electronic circuit with an input and an output to be obtained, even though this implementation was not previously known. It can also obtain the module and phase diagrams of any impedance separately. The device under test (DUT) is connected to a personal computer (PC) via the parallel port by means of an electronic circuit implemented for this purpose. The results are shown on the screen of the PC and can be accessible for use in any further operation. The instrument operates i…

Design, fabrication, and analysis of a spin-valve based current sensor

2004

Abstract In this work, we suggest a novel current sensor design, based on spin valve technology, with a full Wheatstone bridge configuration. The principal characteristic is that the four magnetoresistance sensing elements, fully active, are deposited and patterned at the same time. This way, differences among them should be insignificant, so improving voltage offset and drift temperature parameters. The complete IC fabrication process involves only three lithography steps, making the process cheaper and faster. In order to get a balanced bridge, the measured current must be properly driven, by means of an auxiliary PCB. Some prototypes, with different input impedances, have been fabricated…