Search results for "Optoelectronics"

Combined Analysis of OFDM-UWB Transmission in Hybrid Wireless-Optical Access Networks

2009

[EN] The hybrid wireless-optical transmission of ultra-wideband signals employing orthogonal frequency-division multiplexing modulation (OFDM) ultra-wideband (UWB) as defined in the ECMA-368 standard is experimentally analyzed in this letter. The OFDM-UWB signals provide 400 Mb/s per user at optical distances from 5 to 50 km on standard single-mode fiber (SSMF). The analysis includes the wireless radiation from 0 to 3 m after optical transmission. The results indicate a maximum error-vector-magnitude degradation of 2.5 dB measured at 1.5-m radio after 50-km SSMF optical transmission for the first two UWB channels. This degradation translates to 1-m maximum wireless-reach penalty.

PV systems in the vertical walls: A comparison of innovative structures

2016

This paper presents the performance comparison of PV windows with the purpose of tracing the behavior of next-generation systems, which could favor architectonical integration. More in detail, a dye sensitized solar cell (DSSC) and blue and grey thin film silicon panels have been analyzed. The systems can be placed behind a window or behind a wall of glass blocks. The three generation systems are then compared in terms of both efficiency and Fill Factor.

Heavy ion SEE test of 2 Gbit DDR3 SDRAM

2011

New generation 2 Gbit DDR3 SDRAMs from Micron, Samsung and Nanya have been tested under heavy ions. SEFIs significantly outweigh random SEU errors even at low LET; however, SEFIs can be mitigated by frequent re-initialization.

Analyses of Dual Polarization WDM and SCM Radio over Fiber and Radio over FSO for C-RAN Architecture

2016

En este trabajo se simulan y verifican experimentalmente los esquemas de transmisión para una Arquitectura de Red de Acceso Radio Centralizada (C-RAN) basados en la combinación de dos tecnologías: Radio sobre Fibra (RoF) y Radio sobre FSO (RoFSO). Las configuraciones propuestas se optimizan para la evolución a largo plazo (LTE) con un ancho de banda de 20 MHz utilizando una modulación de amplitud en cuadratura de 64-QAM en términos de magnitud de vector de error (EVM). En primer lugar, se comparan las mediciones de la multiplexación por división de polarización mediante la combinación de RoF y RoFSO (PDM-RoF/FSO) con los modelos de simulación. Esto se amplía con la combinación de PDM-Multip…

A Non-Invasive Thermal Drift Compensation Technique Applied to a Spin-Valve Magnetoresistive Current Sensor

2011

A compensation method for the sensitivity drift of a magnetoresistive (MR) Wheatstone bridge current sensor is proposed. The technique was carried out by placing a ruthenium temperature sensor and the MR sensor to be compensated inside a generalized impedance converter circuit (GIC). No internal modification of the sensor bridge arms is required so that the circuit is capable of compensating practical industrial sensors. The method is based on the temperature modulation of the current supplied to the bridge, which improves previous solutions based on constant current compensation. Experimental results are shown using a microfabricated spin-valve MR current sensor. The temperature compensati…

Charge measurement using an array of Faraday’s Cups on a printed circuit board

2014

Abstract An absolute method of measuring charge is to use a Faraday Cup (FC) principle. This study relates to a novel method of measuring charge on a flat substrate, which is coated with charged powder particles. The substrate consists of an array of FC with different dimensions. The sensor is manufactured using flame-retardant printed circuit board (PCB) technology. The objective of this work is to reduce the charge sharing by developing a grounded shield cup around each conductive cup in the array and accordingly increase cup-to-ground capacitance. The results have confirmed that the improved well shielding would provide a more accurate quantitative charge measurement.

Corrigendum to “Design of compensated multiport waveguide junctions considering mechanization effects” [AEUE – Int J Electron Commun, 69 (1) (2015), …

2015

Quasifractal planar microstrip resonators for microwave circuits

1999

We propose a new shape for microwave planar circuits using the self-similarity of the fractal geometry. This new shape allows the generation of numerous resonant frequencies for this microwave planar resonator due to the surface's encasing. The resonant frequency assessment can be useful for the concept of filters or wide frequency band matching loads as examples, without consuming circuit surface. ©1999 John Wiley & Sons, Inc. Microwave Opt Technol Lett 21: 433–436, 1999.

Electrical-optical characterization of multijunction solar cells under 2000X concentration

2014

In the framework of the FAE "Fotovoltaico ad Alta Efficienza" ("High Efficiency Photovoltaic") Research Project (PO FESR Sicilia 2007/2013 4.1.1.1), we have performed electrical and optical characterizations of commercial InGaP/InGaAs/Ge triple-junction solar cells (1 cm2) mounted on a prototype HCPV module, installed in Palermo (Italy). This system uses a reflective optics based on rectangular off-axis parabolic mirror with aperture 45×45 cm2 leading to a geometrical concentration ratio of 2025. In this study, we report the I-V curve measured under incident power of about 700 W/m2 resulting in an electrical power at maximum point (PMP) of 41.4 W. We also investigated the optical properties…

Towards roll-to-roll fabrication of electronics, optics and optoelectronics for smart and intelligent packaging

2004

Embedding of optoelectrical, optical, and electrical functionalities into low-cost products like packages and printed matter can be used to increase their information content. These functionalities make also possible the realization of new type of entertaining, impressive or guiding effects on the product packages and printed matter. For these purposes, components like displays, photodetectors, light sources, solar cells, battery elements, diffractive optical elements, lightguides, electrical conductors, resistors, transistors, switching elements etc. and their integration to functional modules are required. Additionally, the price of the components for low-end products has to be in cent sc…