Search results for "Printed Circuit Board"

Dismantling and electrochemical copper recovery from Waste Printed Circuit Boards in H2SO4–CuSO4–NaCl solutions

2019

Abstract The worldwide growing of electrical and electronic equipment makes increasingly urgent to find environmentally friendly treatments for e-waste. In this paper, the attention has been focused on i) the eco-friendly dismantling of the electronic components from Waste Printed Circuit Boards and ii) recovering of pure metallic copper, which is the most abundant metal and one of the most valuable in Printed Circuit Boards. After an experimental optimization study, we found that a solution containing 0.5 M H2SO4, 0.4 M CuSO4, and 4 M NaCl can be successfully used to disassemble the electronic components from the boards by leaching of all exposed metals. Air was blown into the leaching sol…

Quasi‐digital front‐ends for current measurement in integrated circuits with giant magnetoresistance technology

2014

In this study, the authors report on two different electronic interfaces for low-power integrated circuits electric current monitoring through current-to-frequency (I-f) conversion schemes. This proposal displays the intrinsic advantages of the quasi-digital systems regarding direct interfacing and self-calibrating capabilities. In addition, as current-sensing devices, they have made use of the giant magnetoresistance (GMR) technology because of its high sensitivity and compatibility with standard complementary metal oxide semiconductor processes. Single elements and Wheatstone bridges based on spin-valves and magnetic tunnel junctions have been considered. In this sense, schematic-level si…

Nanotransducers on printed circuit boards by rational design of high-density, long, thin and untapered ZnO nanowires

2018

Abstract Nanotransducers can offer crucial advantages in comparison with conventional sensors and actuators. However, interfacing and packaging nanostructures into complete electronic systems is very complex. Here we describe a wet chemical method for cointegrating arrays of ZnO nanowires into systems on printed circuit boards (PCBs). First, we deposit on the PCB a MnOOH layer for reproducibly increasing the nanowires density. Afterwards, we numerically demonstrate that the ligand ethylenediamine, at the isoelectric point of the ZnO nanowires tips, can effectively control, at very low concentrations, both zinc speciation and supersaturation in the nutrient solution. Accordingly, we combine …

Manufacturing and testing a thin glass mirror shell with piezoelectric active control

2015

Optics for future X-ray telescopes will be characterized by very large aperture and focal length, and will be made of lightweight materials like glass or silicon in order to keep the total mass within acceptable limits. Optical modules based on thin slumped glass foils are being developed at various institutes, aiming at improving the angular resolution to a few arcsec HEW. Thin mirrors are prone to deform, so they require a careful integration to avoid deformations and even correct forming errors. On the other hand, this offers the opportunity to actively correct the residual deformation: a viable possibility to improve the mirror figure is the application of piezoelectric actuators onto t…

Ultra-low material pixel layers for the Mu3e experiment

2016

The upcoming Mu3e experiment will search for the charged lepton flavour violating decay of a muon at rest into three electrons. The maximal energy of the electrons is 53 MeV, hence a low material budget is a key performance requirement for the tracking detector. In this paper we summarize our approach to meet the requirement of about 0.1 % of a radiation length per pixel detector layer. This includes the choice of thinned active monolithic pixel sensors in HV-CMOS technology, ultra-thin flexible printed circuits, and helium gas cooling.

Zinc Oxide Nanowires on Printed Circuit Boards

2015

Printed circuit boards (PCBs), which are widely used for the fabrication of electronic circuits, can only withstand rather low temperatures. For this reason, the fabrication of high-density, long ZnO nanostructures on PCBs still remains a complex task. In fact, in absence of a seed-layer, whose annealing would require high temperatures, solution-growth methods only allow to synthesize low-density arrays of nanowires. Here we evaluate methods for overcoming this issue and, as a prototype, demonstrate a simple displacement sensor.

MgO Magnetic Tunnel Junction Electrical Current Sensor With Integrated Ru Thermal Sensor

2013

Full Wheatstone bridge electrical current sensor incorporating 114 MgO-based magnetic tunnel junction elements (3 × 30 μm2) connected in series was produced for improved electrical robustness. To that end, magnetic tunnel junctions with R × A ~7 KΩ μm2 tunneling magnetoresistance of 200%, were produced. The sensor was designed with an integrated Ru thin film resistive thermal detector (RTD) for temperature drift monitoring and compensation. In order to achieve a full bridge signal, a U-shaped copper trace was placed under a printed circuit board (PCB) specifically designed for this type of device. The resulting device exhibit sensitivities of 63.9 V/Oe/A in a 75 Oe linear range biased with …

Study of a Novel Electrochemical Method for Copper Recovery from Waste Printed Circuit Boards

2017

This study was carried out to recover copper from printed circuit boards of waste computers through an electrochemical process. To simplify the overall recovery process, large pieces of printed circuit boards were used instead of pulverized samples. In particular, these large pieces were directly used as an anode for copper electrorefining. For this purpose, electronic components and solder mask were initially removed from the boards. The electronic components can be treated separately to recover precious metals using various methods. The removal of solder mask was necessary to expose copper layers to the electrolytic solution and it was removed by a chemical treatment with sodium hydroxide…

Dismantling and copper recovery from Waste Printed Circuit Boards (WPCBs) using an integrated hydro-electrometallurgical approach

Electrical Characterization of a Magnetic Tunnel Junction Current Sensor for Industrial Applications

2012

The objective of the work was the design of a Wheatstone bridge current sensor using MTJ as magnetoresistive elements. Each one of the four resistances of the bridge consists on 360 MTJ single elements connected in series for improved electrical robustness. A printed circuit board (PCB) was designed with a U-shaped copper trace placed under the PCB maintaining a 1.1 mm separation distance between sensor and trace. A 160% of tunnel magnetoresistance effect in the single junction and a 120% in its corresponding series elements connection has been achieved with a sensitivity of 9.2 Ω/Oe in a 65 Oe linear range. The DC sensor sensitivity in response to an external DC current sweeps of ±10, ±20,…