Search results for "VLSI"
showing 5 items of 5 documents
New statistical post processing approach for precise fault and defect localization in TRI database acquired on complex VLSI
2013
International audience; Timing issue, missing or extra state transitions or unusual consumption can be detected and localized by Time Resolved Imaging (TRI) database analysis. Although, long test pattern can challenge this process. The number of photons to process rapidly increases and the acquisition time to have a good signal over noise ratio (SNR) can be prohibitive. As a result, the tracking of the defect emission signature inside a huge database can be quite complicated. In this paper, a method based on data mining techniques is suggested to help the TRI end user to have a good idea about where to start a deeper analysis of the integrated circuit, even with such complex databases.
Multimodal and multicriteria analysis for VLSI expertises and defects localization
2017
The purpose of this manuscript is to exhibit the research work solving the issue of data processing stem from defect localization techniques. This step being decisive in the failure analysis process, scientists have to harness data coming from light emission and laser techniques. Nevertheless, this analysis process is sequential and only depends on the expert’s decision. This factor leads to a not quantified probability of localization. Consequently to solve these issues, a multimodal and multicriteria analysis has been developped, taking advantage of the heterogeneous andcomplementary nature of light emission and laser probing techniques. This kind of process is based on advanced level too…
Operational experience with a large detector system using silicon strip detectors with double sided readout
1992
Abstract A large system of silicon strip detectors with double sided readout has been successfully commissioned over the course of the last year at the e + e − collider LEP. The readout of this 73 728 channel system is performed with custom designed VLSI charge sensitive amplifier chips (CAMEX64A). An overall point resolution of 12 μm on both sides has been acheived for the complete system. The most important difficulties during the run were beam losses into the detector, and a chemical agent deposited onto the electronics; however, the damage from these sources was understood and brought under control. This and other results of the 1991 data-taking run are described with special emphasis o…
Design and test of a prototype silicon detector module for ATLAS Semiconductor Tracker endcaps
2005
The ATLAS Semiconductor Tracker (SCT) will be a central part of the tracking system of the ATLAS experiment. The SCT consists of four concentric barrels of silicon detectors as well as two silicon endcap detectors formed by nine disks each. The layout of the forward silicon detector module presented in this paper is based on the approved layout of the silicon detectors of the SCT, their geometry and arrangement in disks, but uses otherwise components identical to the barrel modules of the SCT. The module layout is optimized for excellent thermal management and electrical performance, while keeping the assembly simple and adequate for a large scale module production. This paper summarizes th…
Automatic defect localization in VLSI circuits: A fusion approach based on the Dempster-Shafer theory
2017
Defect localization in Very Large Integration Cir-cuits (VLSI) requires to use multi-sensor information such aselectrical waveforms, emission microscopy images and frequencymapping in order to detect, localize and identify the failure. Eachsensor provides a specific kind of feature modeling the evidence.Thus, the defect localization in VLSI can be summarized asa problem of data fusion with heterogeneous and impreciseinformation. This study illustrates how to reproduce the humandecision for modeling and fusing the different multi-sensorfeatures by using the Demspter-Shafer theory. We propose notonly an automatic decision rule for mass functions computingbut also confidence intervals to quantif…