0000000000084745
AUTHOR
Luca Furfaro
showing 8 related works from this author
Stealth dicing with Bessel beams and beyond
2016
In the context of laser cutting of transparent materials, we investigate glass cleaving with Bessel beams and report that a modification of the beam with 3 main lobes drastically enhances cleavability and reduces defects.
Ultrafast laser-induced micro-explosion: material modification tool
2016
Femtosecond Bessel pulses with a needle-like intensity distribution were focused inside sapphire crystal to create voids and the shock-wave affected volume which is by more than two orders of magnitude larger as compared with that made by the Gaussian pulse.
Crack formation and cleaving of sapphire with ultrafast bessel beams
2017
Sapphire is a transparent crystalline dielectric of high hardness with many important applications, specifically to the next-generation touchscreens and to the LED growth, as substrates. However, sapphire cutting by ablative techniques is rather slow therefore fast material separation techniques are needed. Material separation by “stealth dicing” has been recently developed, it is based on material cleaving along a plane weakened by multiple ultrafast laser illuminations. This allows usually generating taper-free cutting and avoids material loss. However, the illuminated plane needs small spacing between the shot to shot (typically a few μm) and long damages inside the bulk. This requires l…
Single-shot ultrafast laser processing of high-aspect-ratio nanochannels using elliptical Bessel beams
2017
Ultrafast lasers have revolutionized material processing, opening a wealth of new applications in many areas of science. A recent technology that allows the cleaving of transparent materials via non-ablative processes is based on focusing and translating a high-intensity laser beam within a material to induce a well-defined internal stress plane. This then enables material separation without debris generation. Here, we use a non-diffracting beam engineered to have a transverse elliptical spatial profile to generate high aspect ratio elliptical channels in glass of dimension 350 nm x 710 nm, and subsequent cleaved surface uniformity at the sub-micron level.
High speed cleaving of crystals with ultrafast Bessel beams
2017
International audience; We develop a novel concept for ultra-high speed cleaving of crystalline materials with femtosecond lasers. Using Bessel beams in single shot, fracture planes can be induced nearly all along the Bessel zone in sapphire. For the first time, we show that only for a pulse duration below 650 fs, a single fracture can be induced in sapphire, while above this duration, cracks appear in all crystallographic orientations. We determine the influential parameters which are polarization direction, crystallographic axes and scanning direction. This is applied to cleave sapphire with a spacing as high as 25 μm between laser impacts.
Stealth dicing with ultrafast Bessel beams with engineered transverse profiles
2017
International audience; We investigate high-speed glass cleaving with ultrafast laser beams with engineered transverse intensity profile. We achieve accuracy of ~ 1 µm at 25 mm/s and drastically enhance cleavability compared to standard Bessel beams.
Micron-precision in cleaving glass using ultrafast bessel beams with engineered transverse beam shapes
2017
International audience; Ultrafast lasers in association to beam shaping have shown to be excellent candidates for transparent material processing. Non-diffractive solutions such as Bessel beams allows for precise energy deposition since they are robust to undesired non-linear effects and as they do not distort along the propagation. This offers important opportunities in laser-assisted cleaving, i.e. mechanical medium separation after single-pass laser illumination. Here we break the Bessel beam cylindrical symmetry using a novel anisotropic and non-diffractive solutions to investigate both lateral intensity contributions on material response and induced processing effect for non-cylindrica…
Deviation from threshold model in ultrafast laser ablation of graphene at sub-micron scale
2015
International audience; We investigate a method to measure ultrafast laser ablation threshold with respect to spot size. We use structured complex beams to generate a pattern of craters in CVD graphene with a single laser pulse. A direct comparison between beam profile and SEM characterization allows us to determine the dependence of ablation probability on spot-size, for crater diameters ranging between 700 nm and 2.5 μm. We report a drastic decrease of ablation probability when the crater diameter is below 1 μm which we interpret in terms of free-carrier diffusion.