6533b82efe1ef96bd1293d5c

RESEARCH PRODUCT

Stealth dicing with ultrafast Bessel beams with engineered transverse profiles

Jassem SafiouiRemi MeyerLuca FurfaroR. GiustJohn M. DudleyFrançois CourvoisierPierre-ambroise Lacourt

subject

010302 applied physics[PHYS.PHYS.PHYS-OPTICS]Physics [physics]/Physics [physics]/Optics [physics.optics]Materials scienceScanning electron microscopebusiness.industryLaser cutting02 engineering and technology021001 nanoscience & nanotechnology01 natural sciences7. Clean energyIntensity (physics)symbols.namesakeTransverse planeOptics0103 physical sciencessymbolsPhysics::Accelerator PhysicsWafer dicing0210 nano-technologybusinessUltrashort pulseBessel functionLaser beams

description

International audience; We investigate high-speed glass cleaving with ultrafast laser beams with engineered transverse intensity profile. We achieve accuracy of ~ 1 µm at 25 mm/s and drastically enhance cleavability compared to standard Bessel beams.

https://hal.archives-ouvertes.fr/hal-02300658