0000000000084741
AUTHOR
Remi Meyer
showing 7 related works from this author
Stealth dicing with Bessel beams and beyond
2016
In the context of laser cutting of transparent materials, we investigate glass cleaving with Bessel beams and report that a modification of the beam with 3 main lobes drastically enhances cleavability and reduces defects.
Crack formation and cleaving of sapphire with ultrafast bessel beams
2017
Sapphire is a transparent crystalline dielectric of high hardness with many important applications, specifically to the next-generation touchscreens and to the LED growth, as substrates. However, sapphire cutting by ablative techniques is rather slow therefore fast material separation techniques are needed. Material separation by “stealth dicing” has been recently developed, it is based on material cleaving along a plane weakened by multiple ultrafast laser illuminations. This allows usually generating taper-free cutting and avoids material loss. However, the illuminated plane needs small spacing between the shot to shot (typically a few μm) and long damages inside the bulk. This requires l…
Single-shot ultrafast laser processing of high-aspect-ratio nanochannels using elliptical Bessel beams
2017
Ultrafast lasers have revolutionized material processing, opening a wealth of new applications in many areas of science. A recent technology that allows the cleaving of transparent materials via non-ablative processes is based on focusing and translating a high-intensity laser beam within a material to induce a well-defined internal stress plane. This then enables material separation without debris generation. Here, we use a non-diffracting beam engineered to have a transverse elliptical spatial profile to generate high aspect ratio elliptical channels in glass of dimension 350 nm x 710 nm, and subsequent cleaved surface uniformity at the sub-micron level.
High speed cleaving of crystals with ultrafast Bessel beams
2017
International audience; We develop a novel concept for ultra-high speed cleaving of crystalline materials with femtosecond lasers. Using Bessel beams in single shot, fracture planes can be induced nearly all along the Bessel zone in sapphire. For the first time, we show that only for a pulse duration below 650 fs, a single fracture can be induced in sapphire, while above this duration, cracks appear in all crystallographic orientations. We determine the influential parameters which are polarization direction, crystallographic axes and scanning direction. This is applied to cleave sapphire with a spacing as high as 25 μm between laser impacts.
Stealth dicing with ultrafast Bessel beams with engineered transverse profiles
2017
International audience; We investigate high-speed glass cleaving with ultrafast laser beams with engineered transverse intensity profile. We achieve accuracy of ~ 1 µm at 25 mm/s and drastically enhance cleavability compared to standard Bessel beams.
Micron-precision in cleaving glass using ultrafast bessel beams with engineered transverse beam shapes
2017
International audience; Ultrafast lasers in association to beam shaping have shown to be excellent candidates for transparent material processing. Non-diffractive solutions such as Bessel beams allows for precise energy deposition since they are robust to undesired non-linear effects and as they do not distort along the propagation. This offers important opportunities in laser-assisted cleaving, i.e. mechanical medium separation after single-pass laser illumination. Here we break the Bessel beam cylindrical symmetry using a novel anisotropic and non-diffractive solutions to investigate both lateral intensity contributions on material response and induced processing effect for non-cylindrica…
In-situ diagnostic of ultrashort probes based on Kerr-index transient Bragg grating
2019
Pump-probe experiments are essential tools to investigate ultrafast dynamics of laser-matter interaction. We are particularly interested in the dynamics of transparent dielectrics under high numerical aperture focusing. Two main challenges arise for the weak probe pulse. First, we need a precise knowledge of the probe delay with respect to the pump pulse. Second, dispersion compensation of the ultrashort probe pulse generally requires a prism compressor, which can generate angular dispersion, and therefore incorrect interpretation of the pumpprobe measurements.