6533b7cffe1ef96bd12599a8
RESEARCH PRODUCT
Stealth dicing with Bessel beams and beyond
John M. DudleyRemi MeyerFrançois CourvoisierLudovic RappJassem SafiouiLuca Furfarosubject
symbols.namesakeOpticsMaterials processingMaterials sciencebusiness.industryLaser cuttingsymbolsBeam shapingWafer dicingContext (language use)businessBessel functionBeam (structure)description
In the context of laser cutting of transparent materials, we investigate glass cleaving with Bessel beams and report that a modification of the beam with 3 main lobes drastically enhances cleavability and reduces defects.
| year | journal | country | edition | language |
|---|---|---|---|---|
| 2016-01-01 | Lasers Congress 2016 (ASSL, LSC, LAC) |