0000000000795816

AUTHOR

Alexander Tsibizov

showing 2 related works from this author

Heavy-Ion Microbeam Studies of Single-Event Leakage Current Mechanism in SiC VD-MOSFETs

2020

Heavy-ion microbeams are employed for probing the radiation-sensitive regions in commercial silicon carbide (SiC) vertical double-diffused power (VD)-MOSFETs with micrometer accuracy. By scanning the beam spot over the die, a spatial periodicity was observed in the leakage current degradation, reflecting the striped structure of the power MOSFET investigated. Two different mechanisms were observed for degradation. At low drain bias (gate and source grounded), only the gate-oxide (at the JFET or neck region) is contributing in the ion-induced leakage current. For exposures at drain–source bias voltages higher than a specific threshold, additional higher drain leakage current is observed in t…

Nuclear and High Energy PhysicsMaterials sciencemicrobeamsilicon carbide (SiC) vertical double-diffused power(VD)-MOSFETleakage current degradation01 natural sciencesDie (integrated circuit)chemistry.chemical_compoundpuolijohteet0103 physical sciencesMOSFETSilicon carbideNuclear Physics - ExperimentPower semiconductor deviceElectrical and Electronic EngineeringPower MOSFETsingle-event effect (SEE)010308 nuclear & particles physicsbusiness.industryionisoiva säteilyHeavy ion; leakage current degradation; microbeam; silicon carbide (SiC) vertical double-diffused power(VD)-MOSFET; single-event effect (SEE); single-event leakage current (SELC)JFETSELCMicrobeamSiC VD-MOSFET620single event effectsäteilyfysiikkaNuclear Energy and Engineeringchemistryheavy-ionOptoelectronicsddc:620Heavy ionbusinesssingle-event leakage current (SELC)Voltage
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Heavy-ion induced single event effects and latent damages in SiC power MOSFETs

2022

The advantages of silicon carbide (SiC) power MOSFETs make this technology attractive for space, avionics and high-energy accelerator applications. However, the current commercial technologies are still susceptible to Single Event Effects (SEEs) and latent damages induced by the radiation environment. Two types of latent damage were experimentally observed in commercial SiC power MOSFETs exposed to heavy-ions. One is observed at bias voltages just below the degradation onset and it involves the gate oxide. The other damage type is observed at bias voltages below the Single Event Burnout (SEB) limit, and it is attributed to alterations of the SiC crystal-lattice. Focused ion beam (FIB) and s…

Materials scienceScanning electron microscopeRadiationFocused ion beamelektroniikkakomponentitIonSEEschemistry.chemical_compoundstomatognathic systempuolijohteetGate oxideSilicon carbideSiC MOSFETsHeavy-ionDetectors and Experimental TechniquesElectrical and Electronic EngineeringPower MOSFETSafety Risk Reliability and Qualitybusiness.industryionisoiva säteilyCondensed Matter PhysicsLatent damageAtomic and Molecular Physics and OpticsSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialssäteilyfysiikkachemistrytransistoritOptoelectronicsSiC MOSFETs; Heavy-ion; Latent damage; SEEsbusinessVoltageMicroelectronics Reliability
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