0000000001040227
AUTHOR
Tapio Mäkelä
Economical device for measuring thickness of a thin polymer film
An inexpensive device (about $2K) for thickness measurements of thin (<1 μm) polymer films has been constructed. The homogeneous film is placed on a bulk substrate and three semiconductor lasers of different wavelengths are used to measure the reflectances at normal incidence. The thickness can be deduced with typically 4–8 nm uncertainty.
Towards roll-to-roll fabrication of electronics, optics and optoelectronics for smart and intelligent packaging
Embedding of optoelectrical, optical, and electrical functionalities into low-cost products like packages and printed matter can be used to increase their information content. These functionalities make also possible the realization of new type of entertaining, impressive or guiding effects on the product packages and printed matter. For these purposes, components like displays, photodetectors, light sources, solar cells, battery elements, diffractive optical elements, lightguides, electrical conductors, resistors, transistors, switching elements etc. and their integration to functional modules are required. Additionally, the price of the components for low-end products has to be in cent sc…
Nano-lithography by electron exposure using an Atomic Force Microscope
Abstract We have used a conductive Atomic Force Microscope (AFM) tip to expose a very thin resist film. An exposing current of low energy electrons was induced from the tip to the substrate by applying a small bias voltage. Uniform resist films as thin as 10 nm were fabricated using the Langmuir–Blodgett technique. To orient the defined pattern and to make electrical connections a special larger scale alignment structure was first defined by conventional electron beam lithography, either directly in the Langmuir–Blodgett resist film or in a separate first lift-off process with a thicker resist. The results from the one resist process gave conducting 50 nm lines with a 60 A thick vacuum depo…