Search results for "Format"

showing 10 items of 24643 documents

Effect of process parameters and crystal orientation on 3D anisotropic stress during CZ and FZ growth of silicon

2017

Abstract Simulations of 3D anisotropic stress are carried out in and oriented Si crystals grown by FZ and CZ processes for different diameters, growth rates and process stages. Temperature dependent elastic constants and thermal expansion coefficients are used in the FE simulations. The von Mises stress at the triple point line is ~5–11% higher in crystals compared to crystals. The process parameters have a larger effect on the von Mises stress than the crystal orientation. Generally, the crystal has a higher azimuthal variation of stress along the triple point line (~8%) than the crystal (~2%). The presence of a crystal ridge increases the stress beside the ridge and decreases it on the ri…

010302 applied physicsMaterials scienceSiliconTriple pointPhysics::Opticschemistry.chemical_element02 engineering and technology021001 nanoscience & nanotechnologyCondensed Matter PhysicsRidge (differential geometry)01 natural sciencesThermal expansionInorganic ChemistryStress (mechanics)CrystalCrystallographychemistryCondensed Matter::Superconductivity0103 physical sciencesMaterials Chemistryvon Mises yield criterionComposite material0210 nano-technologyLine (formation)Journal of Crystal Growth
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Temperature Dependent Suns-V<inf>oc</inf> of Multicrystalline Silicon Solar Cells from Different Ingot Positions

2018

This paper presents temperature dependent Suns- Voc measurements on multicrystalline silicon cells originating from different ingot positions. The effective lifetime is found to increase for all cells when the temperature is increased from 25°C to 6°C. However, cells from the top of the ingot show a considerably larger increas 40–50% for illumination conditions of 0.1-1 Sun, compared to an increase of 20-30% observed for cells from the bottom. The decrease in Voc with increasing temperature is found to be lower for cells from the top of the ingot compared to cells from the bottom. The temperature coefficient of the Voc is found to vary 5% along the ingot at 1 Sun, highlighting the influence…

010302 applied physicsMaterials scienceSiliconbusiness.industry020209 energyPhotovoltaic systemchemistry.chemical_element02 engineering and technologySuns in alchemy01 natural sciencesTemperature measurementchemistry0103 physical sciences0202 electrical engineering electronic engineering information engineeringOptoelectronicsIngotbusinessTemperature coefficientSensitivity (electronics)2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC)
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SiC MOSFET vs SiC/Si Cascode short circuit robustness benchmark

2019

Abstract Nowadays, MOSFET SiC semiconductors short circuit capability is a key issue. SiC/Si Cascodes are compound semiconductors that, in some aspects, show a similar MOSFET behaviour. No interlayer dielectric insulation suggests, in theory, Cascode JFETs as more robust devices. The purpose of this paper is to compare the drift and degradation of two commercial devices static parameters by exposing them to different levels of repetitive 1.5 μs short-circuit campaigns at 85% of its breakdown voltage. Short-circuit time has been set experimentally, and longer times result in catastrophic failure of MOSFET devices due to over self-heating. For this purpose, pre- and post-test short circuit ch…

010302 applied physicsMaterials sciencebusiness.industry020208 electrical & electronic engineering02 engineering and technologyDielectricCondensed Matter Physics01 natural sciencesAtomic and Molecular Physics and OpticsSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialsSemiconductorCatastrophic failureRobustness (computer science)0103 physical sciencesMOSFET0202 electrical engineering electronic engineering information engineeringOptoelectronicsBreakdown voltageCascodeElectrical and Electronic EngineeringSafety Risk Reliability and QualitybusinessShort circuitMicroelectronics Reliability
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3D magnetic and thermal fields for in the transformer with homogenised amorphous C-core under high frequency

2017

010302 applied physicsMaterials sciencebusiness.industry020208 electrical & electronic engineeringElectrical engineering02 engineering and technology01 natural sciencesAmorphous solidlaw.inventionlaw0103 physical sciencesThermal0202 electrical engineering electronic engineering information engineeringEddy currentAmorphous metal transformerElectrical and Electronic EngineeringComposite materialbusinessTransformerPRZEGLĄD ELEKTROTECHNICZNY
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Space Charges and Partial Discharges Simultaneous Measurements under DC Stress

2016

In the field of HVDC, the main causes of insulation aging are due to the space charge and PD phenomena. In particular, the purpose of the present work is to verify a possibility to measure simultaneously the space charge and the PDs under DC stress in order to evaluate the correlation between both phenomena. The space charge was measured by using a modified PEA cell and PDs were measured by using a novel wireless sensor system. The space charge profile and the PD pulses carried out simultaneously have been reported and discussed.

010302 applied physicsMaterials sciencebusiness.industry020209 energyElectrical engineering02 engineering and technologyMechanicsSpace (mathematics)01 natural sciencesspace charge partial discharges DC stress HVDCStress (mechanics)Settore ING-IND/31 - Elettrotecnica0103 physical sciences0202 electrical engineering electronic engineering information engineeringbusiness
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Partial discharge of gel insulated high voltage power modules subjected to unconventional voltage waveforms

2016

Performances and duration of the new generation of high voltage power electronic components are dependent on dielectric materials aim to insulating their internal terminals. The presence of defects, some due to faults generated during the manufacturing process, but also due to the internal design of layers and connections, can cause local enhancements of electric field and consequently possible activity of partial discharges phenomena or other effects (aging, tracking) that may result in reduction of device reliability. Furthermore, the usage of unconventional voltage waveforms, like square waves or pulse width modulated waves, additionally increases the electrical aging of the insulation s…

010302 applied physicsMaterials sciencebusiness.industryAcoustics020208 electrical & electronic engineeringElectrical engineeringHigh voltage02 engineering and technologyInsulated-gate bipolar transistor01 natural sciencesSettore ING-IND/31 - ElettrotecnicaReliability (semiconductor)Partial Discharge Gel insulation IGBTvisual_artInsulation systemPower module0103 physical sciencesElectronic componentPartial discharge0202 electrical engineering electronic engineering information engineeringvisual_art.visual_art_mediumbusinessVoltage2016 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
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Deformation of bubbles in silicon gel insulation under an alternating electric field

2019

The behavior of silicone gel under electrical stress plays a significant role in the reliability and durability of high voltage electronic power devices due to its widespread use for the insulation of IGBT modules and other components. The charges accumulation at the bubble boundaries leads to significant displacements due to the establishment of Coulombic forces and the high deformability of colloidal system. The main purpose of this work is to validate a numerical approach useful to investigate, for a given silicone gel, the non-linear relation between the applied HVDC stress and the electric field over an air bubble within the insulation bulk. The analysis has been carried out by means o…

010302 applied physicsMaterials scienceinsulationreliabilityDeformation (mechanics)020209 energyBubbleHigh voltage02 engineering and technologyDielectric01 natural sciencesSpace chargeIGBTSilicone gelStress (mechanics)chemistry.chemical_compoundpartial dischargeSettore ING-IND/31 - ElettrotecnicaSiliconechemistryElectric field0103 physical sciences0202 electrical engineering electronic engineering information engineeringComposite material
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State-space formulation of scalar Preisach hysteresis model for rapid computation in time domain

2015

A state-space formulation of classical scalar Preisach model (CSPM) of hysteresis is proposed. The introduced state dynamics and memory interface allow to use the state equation, which is rapid in calculation, instead of the original Preisach equation. The main benefit of the proposed modeling approach is the reduced computational effort which requires only a single integration over the instantaneous line segment in the Preisach plane. Numerical evaluations of the computation time and model accuracy are provided in comparison to the CSPM which is taken as a reference model.

010302 applied physicsMemory interfacePreisach model of hysteresis0209 industrial biotechnologyApplied MathematicsComputationScalar (mathematics)02 engineering and technologySystems and Control (eess.SY)01 natural sciences020901 industrial engineering & automationLine segmentControl theoryModeling and Simulation0103 physical sciencesFOS: Electrical engineering electronic engineering information engineeringApplied mathematicsComputer Science - Systems and ControlTime domainReference modelMathematics
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Study of the multipactor phenomenon using a full-wave integral equation technique

2017

Abstract Multipactor effect is a well-known phenomenon of RF breakdown in satellite payloads which degrades components, generates undesirable harmonics, contributes to power dissipation and increases noise in communications. Traditionally, multipactor has been investigated with the aim of obtaining the so-called multipactor threshold voltage, or to present different multipaction detection methods. However, very little attention has been focused on analysing this phenomenon using a multimodal approach. The main goal of this work is to analyse the interaction between a multipactor current and a realistic microwave cavity by means of a rigorous and accurate formulation. For the first time to t…

010302 applied physicsMultipactor effect020206 networking & telecommunications02 engineering and technologyDissipation01 natural sciencesNoise (electronics)Integral equationAdmittance parametersHarmonics0103 physical sciences0202 electrical engineering electronic engineering information engineeringElectronic engineeringElectrical and Electronic EngineeringRepresentation (mathematics)Microwave cavityMathematicsAEU - International Journal of Electronics and Communications
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The peculiarities of the radiation damage accumulation kinetics in the case of defect complex formation

2020

Abstract The kinetics of radiation defect accumulation under irradiation by heavy particles is theoretically analysed under the assumption of defect complex genesis, particularly, the ones of anion and cation vacancies. The obtained analytical mathematical model and revealed peculiarities of radiation dose dependencies can be used for analysis of the experimental results for different crystalline materials for solid-state electronics and photonics.

010302 applied physicsNuclear and High Energy PhysicsMaterials sciencebusiness.industryComplex formationRadiation doseKinetics02 engineering and technologyRadiation021001 nanoscience & nanotechnologyPhotochemistry01 natural sciencesIon0103 physical sciencesRadiation damageIrradiationPhotonics0210 nano-technologybusinessInstrumentationNuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms
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