Search results for "Interconnect"
showing 10 items of 128 documents
Performance Study of Split Ferrite Cores Designed for EMI Suppression on Cables
2020
The ideal procedure to start designing an electronic device is to consider the electromagnetic compatibility (EMC) from the beginning. Even so, EMC problems can appear afterward, especially when the designed system is interconnected with external devices. Thereby, electromagnetic interferences (EMIs) could be transmitted to our device from power cables that interconnect it with an external power source or are connected to another system to establish wired communication. The application of an EMI suppressor such as a sleeve core that encircles the cables is a widely used technique to attenuate EM disturbances. This contribution is focused on the characterization of a variation of this cable …
Design of Hierarchical Architectures in Metal–Oganic Frameworks for Catalysis and Adsorption
2020
A key factor to improve the performance of metal–organic frameworks (MOFs) is the design and synthesis of hierarchical interconnected porosity at different length scales. The presence of secondary ...
Evaluation of a new Cr-free alloy as interconnect material for hydrogen production by high temperature water vapour electrolysis: Study in cathode at…
2012
International audience; For economic and ecological reasons, hydrogen is considered as a major energetic vector for the future. Hydrogen production via high temperature water vapour electrolysis (HTE) is a promising technology. A major technical difficulty related to high temperature water vapour electrolysis is the development of interconnects working efficiently for a long period. Working temperature of 800 degrees C enables the use of metallic materials as interconnects. High temperature corrosion behaviour and electrical conductivity of a new Cr-free Fe-Ni-Co alloy were tested in cathode atmosphere (H-2/H2O) at 800 degrees C. The alloy exhibits a poor oxidation resistance but an excelle…
Investigation of La2O3 and/or (Co,Mn)3O4 deposits on Crofer22APU for the SOFC interconnect application
2009
International audience; Chromia forming alloys (stainless steels) are among the best candidates for SOFC interconnects. However, problems of decreasing electronic conductivity during high temperature service and volatility of chromium oxide scales need to be solved. Electronically conductive surface coatings, which also reduce oxide scale growth and chromium volatility, are needed to improve stainless steel interconnects. The goal of this study is to investigate combinations of lanthanum oxide (La2O3) and cobalt manganese oxide ((Co,Mn)3O4) coatings on Crofer22APU stainless steel. Thin film coatings of La2O3 (~200 nm) and Co,Mn (1:1) (~2 mm) were deposited via metal organic chemical vapor d…
Tb/s switching fabrics for optical interconnects using heterointegration of plasmonics and silicon photonics: The FP7 PLATON approach
2010
We present recent work that is carried out within the FP7 project PLATON on novel Tb/s switch fabric architectures and technologies for optical interconnect applications, employing heterointegration of plasmonics, silicon photonics and electronics.
Silicon-based light-emitting devices: Properties and applications of crystalline, amorphous and er-doped nanoclusters
2006
In this paper, we summarize the results of an extensive investigation on the properties of MOS-type light-emitting devices based on silicon nanostructures. The performances of crystalline, amorphous, and Er-doped Si nanostructures are presented and compared. We show that all devices are extremely stable and robust, resulting in an intense room temperature electroluminescence (EL) at around 900 nm or at 1.54 μm. Amorphous nanoclusters are more conductive than the crystalline counterpart. In contrast, nonradiative processes seem to be more efficient for amorphous clusters resulting in a lower quantum efficiency. Erbium doping results in the presence of an intense EL at 1.54 μm with a concomit…
Chip-to-chip plasmonic interconnects and the activities of EU project NAVOLCHI
2012
In this paper, the chip-to-chip interconnection architecture adopted by the EU-project NAVOLCHI are discussed. The plasmonic physical layer consisting of a plasmonic nanoscale laser, a modulator, an amplifier and a detector is introduced. Current statuses of the plasmonic devices are reviewed.
Electrical connections and driving electronics for piezo-actuated x-ray thin glass optics
2016
Use of thin glass modular optics is a technology currently under study to build light, low cost, large area X-ray telescopes for high energy astrophysics space missions. The angular resolution of such telescopes is limited by local deviations from the ideal shape of the mirrors. One possible strategy to improve it consists in actively correcting the mirror profile by gluing thin ceramic piezo-electric actuators on the back of the glasses. A large number of actuators, however, requires several electrical connections to drive them with the different needed voltages. We have developed a process for depositing conductive paths directly on the back of non-planar thin foil mirrors by means of a p…
Opportunity of metallic interconnects for ITSOFC : Reactivity and electrical property.
2006
International audience; Iron-base alloys (Fe-Cr) are proposed hereafter as materials for interconnect of planar-type intermediate temperature solid oxide fuel cell (ITSOFC); they are an alternative solution instead of the use of ceramic interconnects. These steels form an oxide layer (chrornia) which protects the interconnect from the exterior environment, but is an electrical insulator. One solution envisaged in this work is the deposition of a reactive element oxide coating, that slows down the formation of the oxide layer and that increases its electric conductivity. The oxide layer, formed at high temperature on the uncoated alloys, is mainly composed of chromia; it grows in accordance …
LaCoDa: Layered connected topology for massive data centers
2017
One of the fundamental challenges of existing data centers is to design a network that interconnects massive number of servers, and therefore providing an efficient and fault-tolerant routing service to upper-layer applications. Several solutions have been proposed (e.g. FatTree, DCell and BCube), however they either scale too fast (i.e., double exponentially) or too slow. This paper proposes a new data center topology, called LaCoDa, that combines the advantages of previous topologies while avoiding their limitations. LaCoDa uses a small node degree that matches physical restriction for servers, and it also interconnects a large number of servers while reducing the wiring complexity and wi…