Search results for "PHOTOEMISSION"

showing 10 items of 174 documents

Actinic inspection of sub-50 nm EUV mask blank defects

2007

A new actinic mask inspection technology to probe nano-scaled defects buried underneath a Mo/Si multilayer reflection coating of an Extreme Ultraviolet Lithography mask blank has been implemented using EUV Photoemission Electron Microscopy (EUV-PEEM). EUV PEEM images of programmed defect structures of various lateral and vertical sizes recorded at around 13 nm wavelength show that 35 nm wide and 4 nm high buried line defects are clearly detectable. The imaging technique proves to be sensitive to small phase jumps enhancing the visibility of the edges of the phase defects which is explained in terms of a standing wave enhanced image contrast at resonant EUV illumination.

Materials sciencebusiness.industryExtreme ultraviolet lithographyMask inspectionlaw.inventionStanding wavePhotoemission electron microscopyWavelengthOpticslawExtreme ultravioletOptoelectronicsPhotolithographyPhotomaskbusiness23rd European Mask and Lithography Conference
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Inspection of EUVL mask blank defects and patterned masks using EUV photoemission electron microscopy

2008

We report on recent developments of an "at-wavelength" full-field imaging technique for inspection of multilayer mask blank defects and patterned mask samples for extreme ultraviolet lithography (EUVL) by EUV photoemission electron microscopy (EUV-PEEM). A bump-type line defect with a width of approximately 35nm that is buried beneath Mo/Si multilayer has been detected clearly, and first inspection results obtained from a patterned TaN absorber EUVL mask sample is reported. Different image contrast of a similar width of multilayer-covered substrate line defect and on top TaN absorber square has been observed in the EUV-PEEM images, and origin of the difference in their EUV-PEEM image contra…

Materials sciencebusiness.industryExtreme ultraviolet lithographySubstrate (electronics)Condensed Matter PhysicsBlankAtomic and Molecular Physics and OpticsImage contrastSurfaces Coatings and FilmsElectronic Optical and Magnetic Materialslaw.inventionPhotoemission electron microscopyOpticslawOptoelectronicsElectrical and Electronic EngineeringPhotolithographyElectron microscopebusinessLine (formation)Microelectronic Engineering
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Time-resolved photoemission electron microscopy

2009

The excellent time structure of Synchrotron radiation and short-pulse lasers has opened the door to a novel way of time-resolved imaging using PEEM. Periodic or repetitive processes can be studied by stroboscopic illumination with the pulsed photon beam. Since the first experiments in 2003, two fields of applications have been established in several groups. One concerns the investigation of fast magnetisation processes like precessional switching, Gigahertz-eigenmodes of ferromagnetic nanostructures or travelling spin waves in thin films. More recently, femtosecond lasers have been used for imaging of localised surface plasmons in nanoparticles and their temporal behaviour in the femtosecon…

Materials sciencebusiness.industryMagnetic circular dichroismSurface plasmonPhysics::OpticsSynchrotron radiationLaserlaw.inventionCondensed Matter::Materials SciencePhotoemission electron microscopyOpticsSpin wavelawFemtosecondAtomic physicsThin filmbusiness
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Photoemission Electron Microscopy as a tool for the investigation of optical near fields

2005

Photoemission electron microscopy was used to image the electrons photoemitted from specially tailored Ag nanoparticles deposited on a Si substrate (with its native oxide SiO$_{x}$). Photoemission was induced by illumination with a Hg UV-lamp (photon energy cutoff $\hbar\omega_{UV}=5.0$ eV, wavelength $\lambda_{UV}=250$ nm) and with a Ti:Sapphire femtosecond laser ($\hbar\omega_{l}=3.1$ eV, $\lambda_{l}=400$ nm, pulse width below 200 fs), respectively. While homogeneous photoelectron emission from the metal is observed upon illumination at energies above the silver plasmon frequency, at lower photon energies the emission is localized at tips of the structure. This is interpreted as a signat…

Materials sciencebusiness.industryResolution (electron density)General Physics and AstronomyFOS: Physical sciencesPhysics::OpticsElectronPhoton energyLaserlaw.inventionPhotoemission electron microscopyCondensed Matter::Materials ScienceOpticslawFemtosecondSapphireOptoelectronicsbusinessPlasmonOptics (physics.optics)Physics - Optics
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Femtosecond time-resolved photoemission electron microscopy operated at sample illumination from the rear side

2019

We present an advanced experimental setup for time-resolved photoemission electron microscopy (PEEM) with sub-20 fs resolution, which allows for normal incidence and highly local sample excitation with ultrashort laser pulses. The scheme makes use of a sample rear side illumination geometry that enables us to confine the sample illumination spot to a diameter as small as 6 μm. We demonstrate an operation mode in which the spatiotemporal dynamics following a highly local excitation of the sample is globally probed with a laser pulse illuminating the sample from the front side. Furthermore, we show that the scheme can also be operated in a time-resolved normal incidence two-photon PEEM mode w…

Materials sciencebusiness.industryResolution (electron density)Physics::OpticsLaserSample (graphics)Surface plasmon polaritonlaw.inventionInterferometryPhotoemission electron microscopyOpticslawFemtosecondbusinessInstrumentationExcitationReview of Scientific Instruments
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Phase defect inspection of multilayer masks for 13.5 nm optical lithography using PEEM in a standing wave mode

2007

We report on recent developments of an "at wavelength" full-field imaging technique for defect inspection of multilayer mask blanks for extreme ultraviolet lithography (EUVL). Our approach uses photoemission electron microscopy (PEEM) in a near normal incidence mode at 13.5 nut wavelength to image the photoemission induced by the EUV wave field on the multilayer blank surface. We analyze buried defects on Mo/Si multilayer samples down to a lateral size of 50 nm and report on first, results obtained from a six inches mask blank prototype as prerequisite for industrial usage. (c) 2007 Elsevier B.V. All rights reserved.

Materials sciencebusiness.industryphotoemission electronExtreme ultraviolet lithographydefect analysisPhase (waves)Surfaces and InterfacesCondensed Matter PhysicsBlankSurfaces Coatings and Filmslaw.inventionStanding waveextreme ultraviolet lithography (EUVL)WavelengthPhotoemission electron microscopyOpticslawmultilayer mask blanksMaterials ChemistryOptoelectronicsEUV-PEEMPhotolithographybusinessLithographymicroscopy (PEEM)
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Energy level determination in bulk heterojunction systems using photoemission yield spectroscopy: case of P3HT:PCBM

2018

Financial support provided by Scientific Research Project for Students and Young Researchers Nr. SJZ2015/20 realized at the Institute of Solid State Physics, University of Latvia, is greatly acknowledged. This work has been supported by the Latvian State Research Program on Multifunctional Materials IMIS2. Jennifer Mann from Physical Electronics is greatly acknowledged for providing UPS data.

Materials scienceionization energyultraviolet photoelectron spectroscopyAnalytical chemistry02 engineering and technology010402 general chemistry01 natural sciencesPolymer solar cell:NATURAL SCIENCES:Physics [Research Subject Categories]General Materials ScienceSurface layerThin filmSpectroscopyphotoemission yield spectroscopyMechanical EngineeringHeterojunction021001 nanoscience & nanotechnology0104 chemical sciencesorganic materialsthin filmsMechanics of MaterialsYield (chemistry)interfaceIonization energy0210 nano-technologyUltraviolet photoelectron spectroscopyJournal of Materials Science
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A new approach for actinic defect inspection of EUVL multilayer mask blanks: Standing wave photoemission electron microscopy

2006

Extreme ultraviolet lithography (EUVL) at 13.5 nm is the next generation lithography technique capable of printing sub-50 nm structures. With decreasing feature sizes to be printed, the requirements for the lithography mask also become more stringent in terms of defect sizes and densities that are still acceptable and the development of lithography optics has to go along with the development of new mask defect inspection techniques that are fast and offer high resolution (preferable in the range of the minimum feature size) at the same time. We report on the development and experimental results of a new 'at wavelength' full-field imaging technique for defect inspection of multilayer mask bl…

Materials sciencephotoemission electronbusiness.industryExtreme ultraviolet lithographyCondensed Matter Physicsmultilayer mask blankAtomic and Molecular Physics and OpticsSurfaces Coatings and FilmsElectronic Optical and Magnetic Materialslaw.inventionPhotoemission electron microscopyWavelengthOpticslawEUV lithographymicroscopyOptoelectronicsX-ray lithographyElectrical and Electronic EngineeringPhotolithographyactinic defect inspectionbusinessLithographyImage resolutionNext-generation lithographyMicroelectronic Engineering
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The BLAST experiment

2009

The Bates large acceptance spectrometer toroid (BLAST) experiment was operated at the MIT-Bates Linear Accelerator Center from 2003 until 2005. The detector and experimental program were designed to study, in a systematic manner, the spin-dependent electromagnetic interaction in few-nucleon systems. As such the data will provide improved measurements for neutron, proton, and deuteron form factors. The data will also allow details of the reaction mechanism, such as the role of final state interactions, pion production, and resonances to be studied. The experiment used: a longitudinally polarized electron beam stored in the South Hall Storage Ring; a highly polarized, isotopically pure, inter…

Nuclear and High Energy PhysicsTracking detectorScintillator detectorCherenkov detectorNuclear TheoryLinear particle acceleratorlaw.inventionNuclear physicslawNeutron detectionSCATTERINGNeutronSPECTROMETERSTORAGE-RINGBLASTPHOTOEMISSIONNuclear ExperimentInstrumentationCherenkov radiationELECTRON-SPIN POLARIZATIONPhysicsPolarized beamSpectrometerPolarized targetDetectorGAASGAS-TARGETPERFORMANCEPOLARIMETERStorage ringStorage ringSYSTEMCherenkov detectorNuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors, and Associated Equipment
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Three-dimensional characterization of extreme ultraviolet mask blank defects by interference contrast photoemission electron microscopy

2008

A photoemission electron microscope based on a new contrast mechanism "interference contrast" is applied to characterize extreme ultraviolet lithography mask blank defects. Inspection results show that positioning of interference destructive condition (node of standing wave field) on surface of multilayer in the local region of a phase defect is necessary to obtain best visibility of the defect on mask blank. A comparative experiment reveals superiority of the interference contrast photoemission electron microscope (Extreme UV illumination) over a topographic contrast one (UV illumination with Hg discharge lamp) in detecting extreme ultraviolet mask blank phase defects. A depth-resolved det…

Optics and PhotonicsMaterials scienceLightUltraviolet Raysbusiness.industryMicroscopy UltravioletExtreme ultraviolet lithographyEquipment DesignBlankDark field microscopyAtomic and Molecular Physics and Opticslaw.inventionMicroscopy ElectronPhotoemission electron microscopyWavelengthOpticslawExtreme ultravioletMicroscopyOptoelectronicsMicroscopy InterferencePhotolithographybusinessOptics Express
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