Search results for "integrated"
showing 10 items of 1783 documents
On the impact of within-die process variation in GALS-Based NoC Performance
2012
[EN] Current integration scales allow designing chip multiprocessors (CMP), where cores are interconnected by means of a network-on-chip (NoC). Unfortunately, the small feature size of current integration scales causes some unpredictability in manufactured devices because of process variation. In NoCs, variability may affect links and routers causing them not to match the parameters established at design time. In this paper, we first analyze the way that manufacturing deviations affect the components of a NoC by applying a new comprehensive and detailed within-die variability model to 200 instances of an 8¿8 mesh NoC synthesized using 45 nm technology. Later, we show that GALS-based NoCs pr…
Mechanical Tests on Innovative BIPV Façade Components for Energy, Seismic, and Aesthetic Renovation of High-Rise Buildings
2018
The paper shows the results of mechanical tests carried out on prototypes of a new Building Integrated Photovoltaic (BIPV) component developed by the author and SBskin Smart Building Skin s.r.l. This patented innovative component is able to merge structural function, insulation proprieties, and production of clean energy for retrofit actions and/or the construction of translucent faç
Energy Optimization of BIPV Glass Blocks: a Multi-software Study
2017
Abstract The aim of this paper is to show the results of the performance analyses carried out on four patented glass block configurations integrated with third-generation Dye-sensitized Solar Cell (DSC) modules. The analyses take into account the thermal, optical and electrical performance by using three different software (COMSOL Multiphysics, WINDOW, Zemax), also enabling to take into consideration the peculiar three-dimensional geometry of this innovative glazed product. Starting from these results, new configurations improved as for the thermal insulation, are also introduced and studied, in order to make further considerations about the applicability of this building component for the …
Comparison on the use of PV systems in the vertical walls
2015
In this article the preliminary evaluation of the performance of a photovoltaic window is presented. The aim is to trace the behavior of next-generation systems, which favor architectonical integration. Three different systems have been taken into account: a dye sensitized solar cell (DSSC), blue and grey caved silicon panels. The systems can be placed behind a window or behind a wall of glass blocks.
DSSC-integrated Glassblocks for the construction of Sustainable Building Envelopes
2014
The paper shows the first results of the optical performance analysis carried out on the DSSC integrated glassblock, an innovative building product developed at the Department of Architecture of the University of Palermo. In the field of a research that is being conducted in order to define innovative solutions for the construction of photovoltaic and energy efficient translucent building envelopes, different hypotheses of integration of DSSC into the glassblock have been foreseen. The integration of glassblock with third generation PV systems allows to define a novel building-PV product that meets the current requirements of the BIPV (Building Integrated Photovoltaics) market. By means of …
Multicriteria performance analysis of an integrated urban wastewater system for energy management
2017
AbstractThe optimization and management of an integrated urban wastewater system is a complex problem involving many processes and variables. The possible control options are defined by several management strategies that may differently impact the economic, operational or environmental performance of the system. The present paper aims to contribute to the environmental and energy sustainability of urban wastewater systems by means of a multicriteria performance analysis. The paper begins with a complete analysis of the system performance in several fields of interest (energy, environment, quality of service, operation, economy and financial resources), and it highlights the management stren…
A Low-Power Fully-Mosfet Voltage Reference Generator for 90 nm CMOS Technology
2006
An integrated voltage reference generator, designed for being incorporated in standard 90-nm CMOS technology flash memories, is described in this paper. A fully MOSFET based approach, using also subthreshold operated devices, has been adopted in order to achieve low-voltage and low-power requirements and to overcome the difficulties of conventional band-gap reference circuits. The proposed circuit, based on current signals, internally generates two currents with opposite dependence on temperature. The two currents are added, thus canceling almost completely temperature dependence, and then linearly converted into the output voltage. For a temperature variation between -20degC and 90degC, th…
IBM Intelligent Bricks project—Petabytes and beyond
2006
This paper provides an overview of the Intelligent Bricks project in progress at IBM Research. It describes common problems faced by data center operators and proposes a comprehensive solution based on brick architectures. Bricks are hardware building blocks. Because of certain properties, defined here, scalable and reliable systems can be built with collections of identical bricks. An important feature is that brick-based systems must survive the failure of any brick without requiring human intervention, as long as most bricks are operational. This simplifies system management and allows very dense and very scalable systems to be built. A prototype storage server in the form of a 3 × 3 × 3…
Smart cameras on a chip: using complementary metal-oxide-semiconductor (CMOS) image sensors to create smart vision chips
2020
Abstract: In this chapter, we introduce the fundamental concept of smart cameras on a chip or smart vision chips that simultaneously integrate the same die image capture capability and highly complex image processing. Successive technology scaling has made possible the integration of specific processing elements designed at chip level, at column level or at pixel level. To illustrate this continuous evolution, we survey three different categories of vision chips, exploring first the pioneering works on artificial retinas, then describing the most significant computational chips, and finally presenting the most recent image processing chips able to perform complex algorithms at a high frame …
Monolithic integration of GMR sensors for standard CMOS-IC current sensing
2017
Abstract In this work we report on the development of Giant Magnetoresistive (GMR) sensors for off-line current measurements in standard integrated circuits. An ASIC has been specifically designed and fabricated in the well-known AMS-0.35 μm CMOS technology, including the electronic circuitry for sensor interfacing. It implements an oscillating circuit performing a voltage-to-frequency conversion. Subsequently, a fully CMOS-compatible low temperature post-process has been applied for depositing the GMR sensing devices in a full-bridge configuration onto the buried current straps. Sensitivity and resolution of these sensors have been investigated achieving experimental results that show a de…