6533b82bfe1ef96bd128cd95
RESEARCH PRODUCT
Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays
U. Lo CiceroU. Lo CiceroMarco BarberaMarco BarberaAlfonso ColluraGiuseppe LulloC. Arnonesubject
X-ray detectorInterconnectionMaterials scienceFabricationbusiness.industryMicrocalorimeter arrayNTD-Gechemistry.chemical_elementGermaniumNanotechnologyCondensed Matter PhysicsSettore ING-INF/01 - ElettronicaAtomic and Molecular Physics and OpticschemistrySensor arraySolderingThermalIndium bumpFlip-chip bondingX-ray spectroscopyOptoelectronicsGeneral Materials SciencebusinessElectroplatingIndiumdescription
We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads.
| year | journal | country | edition | language |
|---|---|---|---|---|
| 2012-02-02 |