6533b85dfe1ef96bd12bdcf1
RESEARCH PRODUCT
Content based segmentation of patterned wafers
Pierrick BourgeatPierrick BourgeatKenneth W. TobinFabrice MeriaudeauPatrick Gorriasubject
business.industryMachine visionComputer scienceFeature extractionWavelet transformScale-space segmentationImage processingImage segmentationAtomic and Molecular Physics and OpticsComputer Science ApplicationsSegmentationComputer visionArtificial intelligenceElectrical and Electronic EngineeringPhotomaskbusinessdescription
We extend our previous work on the image segmentation of electronic structures on patterned wafers to improve the defect detection process on optical inspection tools. Die-to-die wafer in- spection is based on the comparison of the same area on two neigh- boring dies. The dissimilarities between the images are a result of defects in this area of one of the dies. The noise level can vary from one structure to the other, within the same image. Therefore, seg- mentation is required to create a mask and apply an optimal thresh- old in each region. Contrast variation on the texture can affect the response of the parameters used for the segmentation. We show a method to anticipate these variations with a limited number of train- ing samples, and modify the classifier accordingly to improve the segmentation results. © 2004 SPIE and IS&T.
| year | journal | country | edition | language |
|---|---|---|---|---|
| 2004-07-01 | Journal of Electronic Imaging |