Search results for "Mask"
showing 10 items of 506 documents
Programmable proximity aperture lithography with MeV ion beams
2008
A novel MeV ion beam programmable proximity aperture lithography system has been constructed at the Accelerator Laboratory of the University of Jyvaskyla, Finland. This facility can be used to fabricate three dimensional microstructures in thick (<100μm) polymer resist such as polymethylmethacrylate. In this method, MeV ion beams from the 1.7 MV pelletron and K130 cyclotron accelerators are collimated to a beam spot of rectangular shape. This shape is defined by a computer-controlled aperture made of a pair of L-shaped Ta blades which are in close proximity to the sample to minimize the penumbra broadening. Here the authors report on development of the system, the controlling software, the …
Laser Beam Lithography For 3-D Surface Patterning
1993
A low power laser processing unit, for microlithographic applications on non-planar surfaces, is described. By combining proper laser beam handling, micropositioning, software control and surface coating techniques, a 5-axis robotic system for laser writing has been set up. Light from a He-Cd laser source is fiber-delivered to a writing head, which moves around a resist coated solid object. After exposure, traditional wet processing can be applied. The unit is capable of patterning metal films deposited on samples up to a size of 50x50x100 mm, with 5 micrometer spatial resolution. An application in 3-D circuit fabrication is presented.
Actinic inspection of sub-50 nm EUV mask blank defects
2007
A new actinic mask inspection technology to probe nano-scaled defects buried underneath a Mo/Si multilayer reflection coating of an Extreme Ultraviolet Lithography mask blank has been implemented using EUV Photoemission Electron Microscopy (EUV-PEEM). EUV PEEM images of programmed defect structures of various lateral and vertical sizes recorded at around 13 nm wavelength show that 35 nm wide and 4 nm high buried line defects are clearly detectable. The imaging technique proves to be sensitive to small phase jumps enhancing the visibility of the edges of the phase defects which is explained in terms of a standing wave enhanced image contrast at resonant EUV illumination.
Phase defect inspection of multilayer masks for 13.5 nm optical lithography using PEEM in a standing wave mode
2007
We report on recent developments of an "at wavelength" full-field imaging technique for defect inspection of multilayer mask blanks for extreme ultraviolet lithography (EUVL). Our approach uses photoemission electron microscopy (PEEM) in a near normal incidence mode at 13.5 nut wavelength to image the photoemission induced by the EUV wave field on the multilayer blank surface. We analyze buried defects on Mo/Si multilayer samples down to a lateral size of 50 nm and report on first, results obtained from a six inches mask blank prototype as prerequisite for industrial usage. (c) 2007 Elsevier B.V. All rights reserved.
Nanofabrication on 2D and 3D Topography via Positive‐Tone Direct‐Write Laser Lithography
2019
Direct laser writing (DLW) lithography using two‐photon absorption is a powerful technique mostly used for fabrication of complex structures in micro‐ and nanoscale, by photopolymerizing a negative‐tone resist. In contrast, in this study it is demonstrated that DLW is also well suited for fabricating nano‐ to microscale metallic structures using lift‐off and a positive‐tone photoresist. It is shown first that versatile, fast and large area fabrication is possible on flat two‐dimensional insulating substrates, and an expression for how the line width varies with the scanning speed is derived, with excellent agreement with the experiments. Even more interestingly, a unique application for the…
A new approach for actinic defect inspection of EUVL multilayer mask blanks: Standing wave photoemission electron microscopy
2006
Extreme ultraviolet lithography (EUVL) at 13.5 nm is the next generation lithography technique capable of printing sub-50 nm structures. With decreasing feature sizes to be printed, the requirements for the lithography mask also become more stringent in terms of defect sizes and densities that are still acceptable and the development of lithography optics has to go along with the development of new mask defect inspection techniques that are fast and offer high resolution (preferable in the range of the minimum feature size) at the same time. We report on the development and experimental results of a new 'at wavelength' full-field imaging technique for defect inspection of multilayer mask bl…
Facepiece filtering respirators with exhalation valve should not be used in the community to limit SARS-CoV-2 diffusion.
2020
Recess photomask contact lithography and the fabrication of coupled silicon photonic and plasmonic waveguide switches
2015
Display Omitted A lithography technique capable of printing submicron-sized features inside deep cavities is presented.A so-called recess photomask adapted to the wafer's topography is employed.Based on a standard mask aligner, Recess Photomask Contact Lithography has moderate cost.Its efficiency for a photonic/plasmonic switch application was demonstrated experimentally.The technique is extensible to any design and to wafers with multiple level recesses. A novel lithographic method is presented, based on the use of a mask aligner in the contact mode with a modified photomask, the so-called recess photomask; its goal is the printing of submicron-sized patterns into deep cavities of a chip, …
Middleware for transparent TCP connection migration : masking faulty TCP-based services
2004
Masteroppgave i informasjons- og kommunikasjonsteknologi 2004 - Høgskolen i Agder, Grimstad Mission critical TCP-based services create a demand for robust and fault tolerant TCP communication. Sense Intellifield monitors drill operations on rig sites offshore. Critical TCP-based services need to be available 24 hours, 7 days a week, and the service providers need to tolerate server failure. How to make TCP robust and fault tolerant without modifying existing infrastructure like existing client/server applications, services, TCP stacks, kernels, or operating systems is the motivation of this thesis. We present a new middleware approach, first of its kind, to allow TCP-based services to survi…