Search results for "lithography"

showing 10 items of 242 documents

Direct observation of localized surface plasmon coupling

1999

We report on the direct observation of localized surface plasmon coupling using a photon scanning tunneling microscope. The surface plasmons are excited in gold nanostructures tailored by electron beam lithography. Electromagnetic energy transfer from a resonantly excited nanoparticle to a nanowire, which is not directly excited by the incident light is observed. Our experimental results appear to be in good agreement with theoretical computations based on Green's dyadic technique.

Materials sciencebusiness.industrySurface plasmonNanophotonicsPhysics::OpticsCondensed Matter::Mesoscopic Systems and Quantum Hall EffectMolecular physicsSurface plasmon polaritonlaw.inventionlawOptoelectronicsSurface plasmon resonanceScanning tunneling microscopebusinessPlasmonElectron-beam lithographyLocalized surface plasmonPhysical Review B
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All-optical and electro-optical active plasmonic telecom components

2011

Active plasmonics is an attractive emerging field in which the ability to control the surface plasmon polariton (SPP) propagation finds many applications such as realization of fully functional integrated photonic circuitry. We demonstrate both numerically and experimentally switching of the SPP transmission based on two different approaches namely the all-optical and electro-optical at telecom wavelengths. The plasmonic component consists of a compact and efficient SPP switch utilizing highly sensitive ring resonator which has high sensitivity to the refractive index changes. Fabrication was done via e-beam lithography utilizing advanced proximity corrections. The compenents were character…

Materials sciencebusiness.industrySurface plasmonPhysics::OpticsSurface plasmon polaritonResonatorOpticsOptoelectronicsNear-field scanning optical microscopePhotonicsbusinessTelecommunicationsRefractive indexPlasmonElectron-beam lithographyAdvanced Photonics
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Phase defect inspection of multilayer masks for 13.5 nm optical lithography using PEEM in a standing wave mode

2007

We report on recent developments of an "at wavelength" full-field imaging technique for defect inspection of multilayer mask blanks for extreme ultraviolet lithography (EUVL). Our approach uses photoemission electron microscopy (PEEM) in a near normal incidence mode at 13.5 nut wavelength to image the photoemission induced by the EUV wave field on the multilayer blank surface. We analyze buried defects on Mo/Si multilayer samples down to a lateral size of 50 nm and report on first, results obtained from a six inches mask blank prototype as prerequisite for industrial usage. (c) 2007 Elsevier B.V. All rights reserved.

Materials sciencebusiness.industryphotoemission electronExtreme ultraviolet lithographydefect analysisPhase (waves)Surfaces and InterfacesCondensed Matter PhysicsBlankSurfaces Coatings and Filmslaw.inventionStanding waveextreme ultraviolet lithography (EUVL)WavelengthPhotoemission electron microscopyOpticslawmultilayer mask blanksMaterials ChemistryOptoelectronicsEUV-PEEMPhotolithographybusinessLithographymicroscopy (PEEM)
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Nanofabrication on 2D and 3D Topography via Positive‐Tone Direct‐Write Laser Lithography

2019

Direct laser writing (DLW) lithography using two‐photon absorption is a powerful technique mostly used for fabrication of complex structures in micro‐ and nanoscale, by photopolymerizing a negative‐tone resist. In contrast, in this study it is demonstrated that DLW is also well suited for fabricating nano‐ to microscale metallic structures using lift‐off and a positive‐tone photoresist. It is shown first that versatile, fast and large area fabrication is possible on flat two‐dimensional insulating substrates, and an expression for how the line width varies with the scanning speed is derived, with excellent agreement with the experiments. Even more interestingly, a unique application for the…

Materials sciencelift‐off nanofabricationbusiness.industrynanotekniikka02 engineering and technologytwo‐photon absorption010402 general chemistry021001 nanoscience & nanotechnologyCondensed Matter Physicslasertekniikka01 natural sciencesTwo-photon absorption3d topographydirect laser writing0104 chemical sciencesTone (musical instrument)NanolithographynanorakenteetOptoelectronicsGeneral Materials Science0210 nano-technologybusinessMaskless lithographypositive‐tone resistAdvanced Engineering Materials
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Time-resolved FDTD and experimental FTIR study of gold micropatch arrays for wavelength-selective mid-infrared optical coupling

2021

The work was partially supported by Sweden's innovation agency Vinnova (Large area CVD graphene-based sensors/IR-photodetectors 2020-00797) and EU CAMART2 project (European Union's Horizon 2020 Framework Programme H2020-WIDESPREAD-01-2016-2017-TeamingPhase2 under grant agreement No.739508). TY acknowledges European Regional Development Fund Project No. 1.1.1.2/VIAA/4/20/740.

Materials sciencenano fabricationInfraredFDTDMathematicsofComputing_GENERALInfrared spectroscopyPhotodetectorTP1-118502 engineering and technologyFar field opticsInfrared sensing7. Clean energy01 natural sciencesBiochemistrynear field opticsAnalytical Chemistry010309 opticselectron beam lithography0103 physical sciencesTransmittanceArray data structureElectrical and Electronic EngineeringInstrumentationinfrared sensingNear field opticsbusiness.industryChemical technologyCommunicationNear-field opticsFinite-difference time-domain methodmetal micropatch arrays021001 nanoscience & nanotechnologyAtomic and Molecular Physics and Opticsfar field opticsWavelengthFTIR:NATURAL SCIENCES [Research Subject Categories]OptoelectronicsElectron beam lithography0210 nano-technologybusinessMetal micropatch arraysNano fabrication
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A new approach for actinic defect inspection of EUVL multilayer mask blanks: Standing wave photoemission electron microscopy

2006

Extreme ultraviolet lithography (EUVL) at 13.5 nm is the next generation lithography technique capable of printing sub-50 nm structures. With decreasing feature sizes to be printed, the requirements for the lithography mask also become more stringent in terms of defect sizes and densities that are still acceptable and the development of lithography optics has to go along with the development of new mask defect inspection techniques that are fast and offer high resolution (preferable in the range of the minimum feature size) at the same time. We report on the development and experimental results of a new 'at wavelength' full-field imaging technique for defect inspection of multilayer mask bl…

Materials sciencephotoemission electronbusiness.industryExtreme ultraviolet lithographyCondensed Matter Physicsmultilayer mask blankAtomic and Molecular Physics and OpticsSurfaces Coatings and FilmsElectronic Optical and Magnetic Materialslaw.inventionPhotoemission electron microscopyWavelengthOpticslawEUV lithographymicroscopyOptoelectronicsX-ray lithographyElectrical and Electronic EngineeringPhotolithographyactinic defect inspectionbusinessLithographyImage resolutionNext-generation lithographyMicroelectronic Engineering
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2D photonic defect layers in 3D inverted opals on Si platforms

2006

Dielectric spheres synthesised for the fabrication of self-organized photonic crystals such as opals offer large opportunities for the design of novel nanophotonic devices. In this paper, we show a hexagonal superlattice monolayer of dielectric spheres inscribed on a 3D colloidal photonic crystal by e-beam lithography. The crystal is produced by a variation of the vertical drawing deposition method assisted by an acoustic field. The structures were chosen after simulations showed that a hexagonal super-lattice monolayer in air exhibits an even photonic band gap below the light cone if the refractive index of the spheres is higher than 1.93.

Materials sciencesuperlatticesSuperlatticePhysics::OpticsDielectricphotonic band gapCrystalCondensed Matter::Materials ScienceOpticselectron beam lithographyMonolayerPhotonic crystalrefractive indexnanotechnologybusiness.industrysiliconself-assemblyColloidal crystalmicro-opticsmonolayersintegrated opticsphotonic crystalsdielectric materialsOptoelectronicsPhotonicselemental semiconductorsbusinessElectron-beam lithography
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Direct Writing of Channels for Microfluidics in Silica by MeV Ion Beam Lithography

2011

The lithographic exposure characteristic of amorphous silica (SiO2) was investigated for 6.8 MeV16O3+ions. A programmable proximity aperture lithography (PPAL) technique was used for the ion beam exposure. After exposure, the exposed pattern was developed by selective etching in 4% v/v HF. Here, we report on the development of SiO2in term of the etch depth dependence on the ion fluence. This showed an exponential approach towards a constant asymptotic etch depth with increasing ion fluence. An example of microfluidic channels produced by this technique is demonstrated.

Materials scienceta114Ion beambusiness.industryApertureMicrofluidicsGeneral EngineeringAnalytical chemistryIon beam lithographyIonIon beam depositionEtching (microfabrication)OptoelectronicsbusinessLithographyAdvanced Materials Research
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Elastic configurations of self-supported oxide membranes for fuel cells

2013

Abstract Ultra-thin oxide films are of interest in energy conversion technologies such as low temperature solid oxide fuel cells and permeation membranes. Understanding their thermo-mechanical stability is an important problem. Edge clamped, self-supported thin film membranes show hierarchical wrinkles; with the largest wavelengths in the center, while smaller ones arise near the clamped boundary; correspondingly the largest strains, with tensile stress comparable to the residual stress, are in the vicinity of the clamped boundary. Our results can be understood by simple scaling arguments and are valid for membranes in the post-buckling regime far from threshold. We confirm the validity of …

Materials scienceta114Renewable Energy Sustainability and the EnvironmentOxideEnergy Engineering and Power TechnologyEdge (geometry)Permeationchemistry.chemical_compoundMembranechemistryResidual stressForensic engineeringEnergy transformationElectrical and Electronic EngineeringPhysical and Theoretical ChemistryThin filmComposite materialLithographyJournal of Power Sources
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Colloidal lithography and Metal-Organic Chemical Vapor Deposition process integration to fabricate ZnO nanohole arrays

2010

A complete set up of optimal process conditions for an effective colloidal lithography/catalyst assisted MOCVD process integration is presented. It mainly focuses on the determination of the deposition temperature threshold for ZnO Metal-Organic Chemical Vapour Deposition (MOCVD) as well as the concentration of metal-organic silver (Ag) catalyst. Indeed, the optimization of such process parameters allows to tailor the ZnO film morphology in order to make the colloidal lithography/catalyst assisted MOCVD approach a valuable bottom up method to fabricate bi-dimensional ordered ZnO nanohole arrays. (C) 2010 Elsevier B.V. All rights reserved.

Materials sciencezinc oxide; Nanowires and nanohole arrays; Colloidal lithographyMetals and AlloysNanowirezinc oxideNanotechnologyZnO; Catalyst; Nanowires; Nanohole array; Colloidal lithography; MOCVDSurfaces and InterfacesChemical vapor depositionSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialsCatalysisNanowireNanohole arrayScientific methodProcess integrationMOCVDMaterials ChemistryNanowires and nanohole arraysZnOColloidal lithographyMetalorganic vapour phase epitaxyCatalystThin filmLithography
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