Search results for "microfabric"

Evaluating the shear bond strength of enamel and dentin with or without etching: a comparative study between dimethacrylate-based and silorane-based …

2015

Background: Silorane-based composites and their specific self-etch adhesive were introduced to conquest the polymerization shrinkage of methacrylate-based composites. It has been shown that additional etching of enamel and dentin can improve the bond strength of self-etch methacrylate-based adhesives but this claim is not apparent about silorane-based adhesives. Our objective was to compare the shear bond strength (SBS) of enamel and dentin between silorane-based adhesive resin and a methacrylate-based resin with or without additional etching. Material and Methods: 40 sound human premolars were prepared and divided into two groups: 1- Filtek P60 composite and Clearfil SE Bond adhesive; 2- F…

Bulk filling of Class II cavities with a dual-cure composite: Effect of curing mode and enamel etching on marginal adaptation.

2014

Objectives: This study attempted to find a simple adhesive restorative technique for class I and II cavities on posterior teeth. Study Design: The tested materials were a self-etching adhesive (Parabond, Coltene/Whaledent) and a dual-cure composite (Paracore, Coltene/Whaledent) used in bulk to restore the cavities. Class II MO cavities were performed and assigned to 4 groups depending on the orthophosphoric acid (H3PO4) conditioning of enamel and polymerization method used (chemical or dual). Specimens were subjected to quantitative marginal analysis before and after thermo-mechanical loading. Results: Higher percentages of marginal adaptation at the total margin length, both before and aft…

POSITIONING SELF-ETCHING ADHESIVES: VERSUS OR IN ADDITION TO PHOSPHORIC ACID ETCHING?

2004

Fabrication and Characterization of Double- and Single-Clamped CuO Nanowire Based Nanoelectromechanical Switches

2021

Electrostatically actuated nanoelectromechanical (NEM) switches hold promise for operation with sharply defined ON/OFF states, high ON/OFF current ratio, low OFF state power consumption, and a compact design. The present challenge for the development of nanoelectromechanical system (NEMS) technology is fabrication of single nanowire based NEM switches. In this work, we demonstrate the first application of CuO nanowires as NEM switch active elements. We develop bottom-up and top-down approaches for NEM switch fabrication, such as CuO nanowire synthesis, lithography, etching, dielectrophoretic alignment of nanowires on electrodes, and nanomanipulations for building devices that are suitable f…

Flexible MgO-Based Magnetic Tunnel Junctions on Silicon Substrate

2018

Flexible electronic devices are emerging in many areas, providing novel features and creating new applications [1]. Due to their ubiquitous utilization, flexible magnetic sensors [2] play a critical part in this development. In particular, magnetic tunnel junctions (MTJs) are of great interest, because of advantages like low power consumption or high sensitivity. We report the development of flexible MTJs on a silicon substrate fabricated by a low-cost batch process [3]. Thereby, conventionally fabricated MTJ devices are transformed into flexible ones by thinning down the silicon wafer from 500 μm to 5 μm. This process leads to thin, bendable silicon devices, while maintaining their origina…

Technologies for the fabrication of cylindrical fine line devices

1997

Abstract A microlithographic process suited for metal patterning on cylindrical substrates has been developed. This includes all steps from metal coating to final etching, with resolution in the 5 μm range.

White Etching Crack Root Cause Investigations

2014

White etching crack (WEC) failure is distinct to classical fatigue and driven by the composition of lubricants under special loading conditions; for example, slippage and electricity. The white etching area (WEA) within WEC contains carbon supersaturated ferrite (bcc-iron) and carbides, with a size of a few nanometers. This article presents investigations supporting the hypothesis that WEC processes start within a failure-free period by successive accumulation of a structural distortion. This can be measured by acoustic emission. Failure statistics show a steep ascent in the Weibull diagram (s values beyond 1) leading to the assumption that WEC processes start unsuspicious, as one would see…

Porous inorganic–organic hybrid material by oxygen plasma treatment

2011

In this paper, we present the pore formation on inorganic–organic hybrid material, ORMOCER©, by reactive ion etching. ORMOCERs are composed of inorganic backbone where organic side groups are attached by cross-linking. Etching of ORMOCER in oxygen plasma generates porous materials with different pore sizes depending on the etching parameters. In addition to planar films, this pore formation process is applicable to micro and nanostructures. Characteristics of porous materials are evaluated by contact angle measurement, scanning electron microscopy, Fourier transform infrared-attenuated total reflectance spectroscopy, time-of-flight elastic recoil detection analysis and Rutherford backscatte…

Electrogeneration of Diiodoaurate in Dimethylsulfoxide on Gold Substrate and Localized Patterning

2016

International audience; A localized etching of gold surface by scanning electrochemical microscope technique is presented where a dimethylsulfoxide-based electrolyte charged with iodine is used. The electrogenerated triiodide ion at the platinum ultramicroelectrode tip (feedback mode) acts as an oxidant for gold surface. The effects of electrode diameter and the bias time have been investigated. The approach curve method was used to hold the electrode tip close to the gold surface. A scanning electron microscope is used to observe the etched gold surfaces where disk-shaped dots are generated. The diameter of these holes depends directly on the Pt electrode diameter and the bias time.

Mesoporous SiC with Potential Catalytic Application by Electrochemical Dissolution of Polycrystalline 3C-SiC

2018

Electrochemical dissolution of highly doped (ρ ∼ 1 mΩ·cm, n-type) polycrystalline 3C-SiC in HF/H2O and HF/H2O/ethanol solutions allowed production of porous silicon carbide (por-SiC) and soluble carbon fluorooxide nanoparticles as a byproduct. The por-SiC is a crystalline material with large pore volume, surface area close to 100 m2 g–1, and open mesoporous structure. The surface of por-SiC is covered with a thin carbon-enriched layer, bearing carboxylic acid groups. Depending on the SiC resistivity, etchant composition, and current density, three different types of por-SiC morphology, namely, a macroporous tubular, mesoporous hierarchical, and mesoporous filamentary were revealed. A qualit…