Search results for "LIC"

showing 10 items of 51177 documents

A procedure for slicing and characterizing soft heterogeneous and irregular-shaped tissue

2020

Abstract This paper presents a slicing technique useful to prepare precise and repeatable samples from organs which are irregularly shaped and highly heterogeneous for mechanical testing and advanced microscopy observation. The suggested technique does not seem to influence the internal microstructure and it is employed here for testing specimens cut from different region of the meniscal tissue. Fast Fourier Transform analysis is used to quantify characteristic features of the microstructure (collagen fibers orientation, pore size) after slicing prior mechanical testing. Uniaxial (relaxation) tests are performed on dog-bone meniscal samples. Stress relaxation testing results on samples cut …

010302 applied physicsMaterials scienceOrientation (computer vision)Fast Fourier transform02 engineering and technology021001 nanoscience & nanotechnologyMicrostructure01 natural sciencesSlicingStress (mechanics)0103 physical sciencesMicroscopyStress relaxationRelaxation (approximation)0210 nano-technologyBiomedical engineeringMaterials Today: Proceedings
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Optimization of physicochemical and optical properties of nanocrystalline TiO 2 deposited on porous silicon by metal-organic chemical vapor depositio…

2020

International audience; Titanium dioxide (TiO2) is very employed in solar cells due to its interesting physicochemical and optical properties allowing high device performances. Considering the extension of applications in nanotechnologies, nanocrystalline TiO2 is very promising for nanoscale components. In this work, nanocrystalline TiO2 thin films were successfully deposited on porous silicon (PSi) by metal organic chemical vapor deposition (MOCVD) technique at temperature of 550°C for different periods of times: 5, 10 and 15 min. The objective was to optimize the physicochemical and optical properties of the TiO2/PSi films dedicated for photovoltaic application. The structural, morphologi…

010302 applied physicsMaterials sciencePolymers and PlasticsMetals and Alloys02 engineering and technologyChemical vapor deposition021001 nanoscience & nanotechnologyPorous silicon01 natural sciences7. Clean energyNanocrystalline materialSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialsBiomaterialsMetalChemical engineeringvisual_art0103 physical sciencesvisual_art.visual_art_medium[INFO]Computer Science [cs]Metalorganic vapour phase epitaxy0210 nano-technology[CHIM.CHEM]Chemical Sciences/Cheminformatics
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Validation of mathematical model for CZ process using small-scale laboratory crystal growth furnace

2018

The present material is focused on the modelling of small-scale laboratory NaCl-RbCl crystal growth furnace. First steps towards fully transient simulations are taken in the form of stationary simulations that deal with the optimization of material properties to match the model to experimental conditions. For this purpose, simulation software primarily used for the modelling of industrial-scale silicon crystal growth process was successfully applied. Finally, transient simulations of the crystal growth are presented, giving a sufficient agreement to experimental results.

010302 applied physicsMaterials scienceScale (ratio)Mechanical engineeringCrystal growth02 engineering and technology021001 nanoscience & nanotechnologycomputer.software_genre01 natural sciencesSimulation softwareMonocrystalline siliconScientific method0103 physical sciencesTransient (oscillation)0210 nano-technologyMaterial propertiescomputerIOP Conference Series: Materials Science and Engineering
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Reactive Sintering of molybdenum disilicide by Spark Plasma Sintering from mechanically activated powder mixtures: Processing parameters and properti…

2008

Abstract Dense molybdenum disilicide with a nano-organized microstructure was synthesized by mechanical activation, by producing nanostructured agglomerates of a 1:2 mixture of Mo and Si, followed by the synthesis/consolidation in one step using SPS technology. In order to synthesize a dense molybdenum disilicide with a perfectly controlled microstructure, an investigation of the influence of Spark Plasma Sintering processing parameters (temperature, heating rate, mechanical pressure and holding time) on the chemical composition and the microstructure characteristics has been performed. The present work shows also that the so-obtained materials present better oxidation resistance in compari…

010302 applied physicsMaterials scienceScanning electron microscopeMechanical EngineeringMetallurgyMetals and AlloysMolybdenum disilicideSpark plasma sinteringSintering02 engineering and technology[CHIM.MATE]Chemical Sciences/Material chemistry021001 nanoscience & nanotechnologyMicrostructure01 natural scienceschemistry.chemical_compoundchemistryMechanics of MaterialsAgglomerate[ CHIM.MATE ] Chemical Sciences/Material chemistry0103 physical sciencesOxidizing agentVickers hardness testMaterials Chemistry0210 nano-technologyComputingMilieux_MISCELLANEOUS
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Fluence effect on ion-implanted As diffusion in relaxed SiGe

2005

A systematic study on the fluence (5 × 108 − 4 × 1014 cm−2) dependence of ion-implanted As diffusion in relaxed Si1 − xGex alloys (with x = 0.2, 0.35 and 0.5) and silicon has been performed by the modified radiotracer and secondary ion mass spectrometry techniques. With fluences above 4 × 1011 cm−2 a clear fluence-dependent enhancement in arsenic diffusion was noted for Si1 − xGex. In case of arsenic-implanted silicon such fluence dependency was not observed. This can be assigned to enhanced implantation-induced damage formation and more deficient radiation damage recovery of SiGe.

010302 applied physicsMaterials scienceSiliconAnalytical chemistryGeneral Physics and Astronomychemistry.chemical_element02 engineering and technology021001 nanoscience & nanotechnology01 natural sciencesFluenceIonSecondary ion mass spectrometrychemistry0103 physical sciencesRadiation damageDiffusion (business)0210 nano-technologyArsenicEurophysics Letters
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HCl gas gettering of low-cost silicon

2013

HCl gas gettering is a cheap and simple technique to reduce transition metal concentrations in silicon. It is attractive especially for low-cost silicon materials like upgraded metallurgical grade (UMG) silicon, which usually contain 3d transition metals in high concentrations. Etching of silicon by HCl gas occurs during HCl gas gettering above a certain onset temperature. The etching rate as well as the gettering efficiency was experimentally determined as a function of the gettering temperature, using UMG silicon wafers. The activation energy of the etching reaction by HCl gas was calculated from the obtained data. The gettering efficiency was determined by analyzing Ni as a representativ…

010302 applied physicsMaterials scienceSiliconEtching rateInorganic chemistrychemistry.chemical_element02 engineering and technologySurfaces and InterfacesActivation energy021001 nanoscience & nanotechnologyCondensed Matter Physics7. Clean energy01 natural sciencesSurfaces Coatings and FilmsElectronic Optical and Magnetic MaterialschemistryTransition metalGetterEtching (microfabrication)0103 physical sciencesMaterials ChemistryWaferElectrical and Electronic Engineering0210 nano-technologyInductively coupled plasma mass spectrometryphysica status solidi (a)
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Modelling of thermal field and point defect dynamics during silicon single crystal growth using CZ technique

2018

Abstract Silicon single crystal growth by the Czochralski (CZ) technique is studied numerically using non-stationary mathematical models which allow to predict the evolution of the CZ system in time, including Dash neck, cone and cylindrical growth stages. The focus is on the point defect dynamics, also considering the effect of the thermal stresses. During the cylindrical stage, the crystal pull rate is temporarily reduced as in experiments by Abe et al. The crystal radius and heater power change is explicitly considered in the calculations for crystal diameters of 50, 100 and 200 mm and the agreement with experiments is discussed.

010302 applied physicsMaterials scienceSiliconField (physics)Mathematical modelchemistry.chemical_element02 engineering and technologyRadiusMechanics021001 nanoscience & nanotechnologyCondensed Matter Physics01 natural sciencesInorganic ChemistryCrystalchemistry0103 physical sciencesThermalMaterials ChemistryPoint (geometry)0210 nano-technologyFocus (optics)Journal of Crystal Growth
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3D modeling of growth ridge and edge facet formation in 〈100〉 floating zone silicon crystal growth process

2019

Abstract A 3D quasi-stationary model for crystal ridge formation in FZ crystal growth systems for silicon is presented. Heat transfer equations for the melt and crystal are solved, and an anisotropic crystal growth model together with a free surface shape solver is used to model the facet growth and ridge formation. The simulation results for 4″ and 5″ crystals are presented and compared to experimental ridge shape data.

010302 applied physicsMaterials scienceSiliconPhysics::Opticschemistry.chemical_elementCrystal growthGeometry02 engineering and technologyEdge (geometry)021001 nanoscience & nanotechnologyCondensed Matter PhysicsRidge (differential geometry)01 natural sciencesInorganic ChemistryMonocrystalline siliconCrystalchemistryCondensed Matter::SuperconductivityFree surface0103 physical sciencesMaterials ChemistryFacet0210 nano-technologyJournal of Crystal Growth
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Effect of process parameters and crystal orientation on 3D anisotropic stress during CZ and FZ growth of silicon

2017

Abstract Simulations of 3D anisotropic stress are carried out in and oriented Si crystals grown by FZ and CZ processes for different diameters, growth rates and process stages. Temperature dependent elastic constants and thermal expansion coefficients are used in the FE simulations. The von Mises stress at the triple point line is ~5–11% higher in crystals compared to crystals. The process parameters have a larger effect on the von Mises stress than the crystal orientation. Generally, the crystal has a higher azimuthal variation of stress along the triple point line (~8%) than the crystal (~2%). The presence of a crystal ridge increases the stress beside the ridge and decreases it on the ri…

010302 applied physicsMaterials scienceSiliconTriple pointPhysics::Opticschemistry.chemical_element02 engineering and technology021001 nanoscience & nanotechnologyCondensed Matter PhysicsRidge (differential geometry)01 natural sciencesThermal expansionInorganic ChemistryStress (mechanics)CrystalCrystallographychemistryCondensed Matter::Superconductivity0103 physical sciencesMaterials Chemistryvon Mises yield criterionComposite material0210 nano-technologyLine (formation)Journal of Crystal Growth
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Temperature Dependent Suns-V<inf>oc</inf> of Multicrystalline Silicon Solar Cells from Different Ingot Positions

2018

This paper presents temperature dependent Suns- Voc measurements on multicrystalline silicon cells originating from different ingot positions. The effective lifetime is found to increase for all cells when the temperature is increased from 25°C to 6°C. However, cells from the top of the ingot show a considerably larger increas 40–50% for illumination conditions of 0.1-1 Sun, compared to an increase of 20-30% observed for cells from the bottom. The decrease in Voc with increasing temperature is found to be lower for cells from the top of the ingot compared to cells from the bottom. The temperature coefficient of the Voc is found to vary 5% along the ingot at 1 Sun, highlighting the influence…

010302 applied physicsMaterials scienceSiliconbusiness.industry020209 energyPhotovoltaic systemchemistry.chemical_element02 engineering and technologySuns in alchemy01 natural sciencesTemperature measurementchemistry0103 physical sciences0202 electrical engineering electronic engineering information engineeringOptoelectronicsIngotbusinessTemperature coefficientSensitivity (electronics)2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC)
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