Search results for "Transistor"
showing 10 items of 234 documents
Mixed-type circuits with distributed and lumped parameters as correct models for integrated structures
1991
The technology of integrated circuits imposes upon their designers the need to deal with structures with distributed parameters. Figure 4.1 shows a schematic diagram of part of a digital integrated chip, consisting of an n MOS transistor with gate (G), drain (D) and source (S) as terminals, and its thin-film connection with the rest of the chip. This on-chip connection can be made by metals (Al, W), polycristaline silicon (polysilicon) or metal suicides (WSi 2 ). Alternative materials to oxide-passivated silicon substrates are saphire and gallium arsenide (Saraswat and Mohammadi [1982], Yuan et al. [1982], Passlack et al. [1990]).
ELECTROCHEMICAL FABRICATION OF METAL/OXIDE/CONDUCTING POLYMER JUNCTIONS FOR ELECTRONIC DEVICES
2014
Si Donor Incorporation in GaN Nanowires
2015
With increasing interest in GaN based devices, the control and evaluation of doping are becoming more and more important. We have studied the structural and electrical properties of a series of Si-doped GaN nanowires (NWs) grown by molecular beam epitaxy (MBE) with a typical dimension of 2-3 μm in length and 20-200 nm in radius. In particular, high resolution energy dispersive X-ray spectroscopy (EDX) has illustrated a higher Si incorporation in NWs than that in two-dimensional (2D) layers and Si segregation at the edge of the NW with the highest doping. Moreover, direct transport measurements on single NWs have shown a controlled doping with resistivity from 10(2) to 10(-3) Ω·cm, and a car…
Increased conductivity of a hole transport layer due to oxidation by a molecular nanomagnet
2008
Thin film transistors based on polyarylamine poly?N,N?-diphenyl-N,N ?bis?4-hexylphenyl?- ?1,1?biphenyl?-4,4?-diamine ?pTPD? were fabricated using spin coating in order to measure the mobility of pTPD upon oxidation. Partially oxidized pTPD with a molecular magnetic cluster showed an increase in mobility of over two orders of magnitude. A transition in the mobility of pTPD upon doping could also be observed by the presence of a maximum obtained for a given oxidant ratio and subsequent decrease for a higher ratio. Such result agrees well with a previously reported model based on the combined effect of dipolar broadening of the density of states and transport manifold filling. Peer Reviewed
From monolayer to multilayer N-channel polymeric field-effect transistors with precise conformational order
2012
Monolayer field-effect transistors based on a high-mobility n-type polymer are demonstrated. The accurate control of the long-range order by Langmuir-Schafer (LS) deposition yields dense polymer packing exhibiting good injection properties, relevant current on/off ratio and carrier mobility in a staggered configuration. Layer-by-layer LS film transistors of increasing thickness are fabricated and their performance compared to those of spin-coated films.
Two-Step Solution-Processed Two-Component Bilayer Phthalocyaninato Copper-Based Heterojunctions with Interesting Ambipolar Organic Transiting and Eth…
2016
International audience; The two-component phthalocyaninato copper-based heterojunctions fabricated from n-type CuPc(COOC8H17)(8) and p-type CuPc(OC8H17)(8) by a facile two-step solution-processing quasi-Langmuir-Shafer method with both n/p- and p/n-bilayer structures are revealed to exhibit typical ambipolar air-stable organic thin-film transistor (OTFT) performance. The p/n-bilayer devices constructed by depositing CuPc(COOC8H17)(8) film on CuPc(OC8H17)(8) sub-layer show superior OTFT performance with hole and electron mobility of 0.11 and 0.02 cm(2) V-1 s(-1), respectively, over the ones with n/p-bilayer heterojunction structure with the hole and electron mobility of 0.03 and 0.016 cm(2) …
TRANSIENT SEMICONDUCTOR DEVICE SIMULATION INCLUDING ENERGY BALANCE EQUATION
1992
An efficient numerical method for the solution of hot‐carrier transport equations describing transient processes in submicrometer semiconductor devices is proposed. The calculations of transient processes in submicrometer MOS transistor were carried out and compared with the results obtained by conventional drift‐diffusion model.
<title>Evolution of optical links toward full-optical transparency</title>
2003
In this paper we review issues of evolution of optical networks towards their full optical transparency and present sequence of eliminating non-transparent elements out of optical links (networks). Architectures of optical commutators with electrical and optical cores have been presented, as well as a structure of OMO (optical-millimeter wave-optical) switching fabric. An example of pure al-optical switch, made by Luxcore, utilizing dispersion compensating elements, wavelength converters and and variable optical attenuators (VOA) operating entirely in optical domain without optical-electrical-optical (OEO) conversions, was quoted. We brought up an issue of all-optical 3R signal regeneration…
Analysis of compressor architectures in MOS current-mode logic
2010
This paper is concerned with the design and the comparison of different compressor architectures for high performance multipliers in MOS current-mode logic (MCML). More specifically, three architectures have been designed for 3-2, 4-2 and 5-2 compressors and two architectures for 7-2 compressors. The various implementations for each type of compressor have been compared one another. This investigation indicates that the architectures based exclusively on three-level MCML gates are the most suitable for MCML implementation in terms of speed, power consumption and area. Design guidelines are provided to improve compressor performance. All the compressors were designed in a TSMC 180nm CMOS tec…
HEMT for low-noise microwaves: CAD-oriented performance evaluation
1995
This paper shows how a graphic processing of low-noise HEMT's small signal parameters, allows evaluating and comparing the actual performance obtainable in front-end applications. HEMT's tradeoff charts which solve tradeoffs among the basic low-noise amplifier performance are reported. Figures of merit for microwave low-noise HEMT which represent a fast way of evaluating HEMT in actual working conditions and of selecting the proper transistor, are defined. As an example, the tradeoff charts and the figures of merit of two HEMT's (Fujitsu FHR02FH, Sony 2SK677) and a pseudomorphic-HEMT (Celeritek CFB001-03) are reported and compared with the data sheets. © 1995, IEEE. All rights reserved.