0000000000077752
AUTHOR
Kevin Sanchez
showing 11 related works from this author
Automatic Processing Scheme for Low Laser Invasiveness Electro Optical Frequency Mapping mode
2016
International audience; Electro optical techniques are efficient backside contactless techniques usually used for design debug and defect location in modern VLSI. Unfortunately, the signal to noise ratio is quite low and depends on laser power with potential device stress due to long acquisition time or high laser power, especially in up to date technologies. Under these conditions, to maintain a good signal or image quality, specific signal or image processing techniques can be implemented. In this paper, we proposed a new spatial filtering by stationary wavelets and contrast enhancement which allows the use of low laser power and short acquisition time in image mode.
Frequency mapping in dynamic light emission with wavelet transform
2013
International audience; Dynamic photon emission microscopy is an e cient tool to analyse today's integrated circuit. Nevertheless, the reduction of transistor's dimensions leads to more complex acquisitions where many spots can be seen. A frequency characterization of the whole acquired area can help to have a better understanding of it. With that purpose in mind, a new methodology to draw frequency mapping of dynamic light emission acquisition is reported. It is fully automated and based on wavelet transform and autocorrelation function. Regarding the possible use in an industrial context, the suggested method can help to localize abnormal emission activity and it gives some perspectives o…
Spatial correction in dynamic photon emission by affine transformation matrix estimation
2014
International audience; Photon emission microscopy and Time Resolved Imaging have proved their efficiency for defect localization on VLSI. A common process to find defect candidate locations is to draw a comparison between acquisitions on a normally working device and a faulty one. In order to be accurate and meaningful, this method requires that the acquisition scene remains the same between the two parts. In practice, it can be difficult to set. In this paper, a method to correct position by affine matrix transformation is suggested. It is based on image features detection, description and matching and affine transformation estimation.
Optical Probing (EOFM/TRI): A large set of complementary applications for ultimate VLSI
2013
International audience; Electro Optical Techniques (EOFM: Electro Optical Frequency Mapping and EOP: Electro Optical Probing) and Dynamic Light Emission Techniques (TRE: Time Resolved Emission and TRI: Time Resolved Imaging) are dynamic optical probing techniques widely used at IC level for design debug and defect localization purpose. They can pinpoint the origin of timing issue or logic fault in up to date CMOS devices. Each technique has its advantages and its drawbacks allowing a common set of applications and more specific ones. We have been involved in the development of the most advanced techniques related to EOFM and TRI on various devices (down to 28nm technology). What we can expe…
Filtering and emission area identification in the Time Resolved Imaging data
2012
Abstract Time Resolved Imaging (TRI) acquisitions allow precise timing analysis of emission spots. Up to date technologies deeply challenge their isolation by hiding the weak ones, under sizing or over sizing visually detectable emission spots and finally by jeopardizing timing resolution. We report on an algorithm based on 1 and 2D signal processing tools which automates the identification of emission sites and optimizes separation between noise and useful signal, even for weak spots surrounding strong emission areas. The application of the algorithm on several sets of data from different types of devices and their results are also discussed.
Automatic defect localization in VLSI circuits: A fusion approach based on the Dempster-Shafer theory
2017
Defect localization in Very Large Integration Cir-cuits (VLSI) requires to use multi-sensor information such aselectrical waveforms, emission microscopy images and frequencymapping in order to detect, localize and identify the failure. Eachsensor provides a specific kind of feature modeling the evidence.Thus, the defect localization in VLSI can be summarized asa problem of data fusion with heterogeneous and impreciseinformation. This study illustrates how to reproduce the humandecision for modeling and fusing the different multi-sensorfeatures by using the Demspter-Shafer theory. We propose notonly an automatic decision rule for mass functions computingbut also confidence intervals to quantif…
New statistical post processing approach for precise fault and defect localization in TRI database acquired on complex VLSI
2013
International audience; Timing issue, missing or extra state transitions or unusual consumption can be detected and localized by Time Resolved Imaging (TRI) database analysis. Although, long test pattern can challenge this process. The number of photons to process rapidly increases and the acquisition time to have a good signal over noise ratio (SNR) can be prohibitive. As a result, the tracking of the defect emission signature inside a huge database can be quite complicated. In this paper, a method based on data mining techniques is suggested to help the TRI end user to have a good idea about where to start a deeper analysis of the integrated circuit, even with such complex databases.
Pattern image enhancement by extended depth of field
2014
International audience
Cluster matching in time resolved imaging for VLSI analysis
2014
International audience; If scaling has the benefit of enabling manufacturers to design tomorrow's integrated circuits, from the failure analyst point of view it also has the drawback of making devices more complex. The test sequence for modern VLSI can be quite long, with thousands of vector. Dynamic photon emission databases can contain millions of photons representing thousands of state changes in the region of interest. Finding a candidate location where to perform physical analysis is quite challenging, especially if the fault occurs on a single vector. In this paper, we suggest a new methodology to find single vector fault in dynamic photon emission database. The process is applied at …
Pattern image enhancement by extended depth of field
2014
Abstract Most optical defect localization techniques such as dynamic laser stimulation or photon emission microscopy require a pattern image of the device to be taken. The main purpose is for device navigation, but it also enables the analyst to identify the location of the monitored activity by superimposing it onto the pattern image. The defect localization workflow usually starts at low or medium magnification. At these scales, several factors can lead to a lack of orthogonality of the sample with the optical axis of the system. Therefore, images can be locally out of focus and poorly resolved. In this paper, a method based on Depth of Field Extension is suggested to correct the pattern …
Unsupervised image processing scheme for transistor photon emission analysis in order to identify defect location
2015
International audience; The study of the light emitted by transistors in a highly scaled complementary metal oxide semiconductor (CMOS) integrated circuit (IC) has become a key method with which to analyze faulty devices, track the failure root cause, and have candidate locations for where to start the physical analysis. The localization of defective areas in IC corresponds to a reliability check and gives information to the designer to improve the IC design. The scaling of CMOS leads to an increase in the number of active nodes inside the acquisition area. There are also more differences between the spot’s intensities. In order to improve the identification of all of the photon emission sp…